Robert Boschgmbh

Walter Roethlingshoefer

Ulrich Goebel

Kurt Weiblen

Walter Beck

Dietrich Bergfried

Annette Seibold

Oliver Gradtke

Detlef Nitsche

Werner Gruenwald

Gert Jakob

Susumu Nishigaki

Roland Schmid

Paul Wickett

Manfred Moser

Hans-Heinrich Maue

Ralf Haug

Eric Ochs

Elmar Huber

Roland Gerstner

Albert-Andreas Hoebel

Uwe Lipphardt

Michael Krapp

Peter Tauber

Uwe Schaub

Juergen Schwaiger

Dietmar Schaible

Klaus-Peter Dambock

Christian Luckner

Manfred Boehm

Juergen Egerter

Bernhard Bachor

Markus Werner

Gerhard Zucker

Ulrich Goebels

A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.

Method for the production of a ceramic multilayer circuit arrangement

The invention relates to a method for producing a ceramic component, a ceramic component, and a component assembly having a ceramic component and a connection component. The method according to the invention for producing a ceramic component () comprises the steps: a) providing a ceramic substrate (), wherein a conducting path () is arranged in the interior and/or on the surface of the ceramic substrate (), and at least some regions of the ceramic substrate () are covered by a glaze (); b) creating a contacting opening () in the glaze () in a region of a contact region () of the conducting path () to be contacted; c) applying a metallic layer () in the region of the contacting opening () for contacting the conducting path () in the contact region ().

Method for producing a ceramic component, ceramic component and component assembly

The invention relates to a control device () for a motor vehicle, comprising a housing () and at least one circuit carrier (), which is arranged in an inner chamber of the housing () and comprises at least one first contact element () that establishes an electric connection to at least one second contact element () of a plug receptacle () on at least one housing wall (), wherein the second contact element () is guided through the at least one housing wall () and is designed on the inside as a contact spring that rests against an associated first contact element () by spring force, and to a related method for mounting a control device for a motor vehicle. According to the invention, the at least one housing wall () comprises receiving means () for a first circuit carrier (), wherein the first circuit carrier () is guided through guide means () designed in the housing (), wherein the guide means () and/or the receiving means () form a mechanical stop () for the first circuit carrier () that is designed such that the position of the first circuit carrier () is fixed in the mechanical stop () with sufficiently small tolerance such that the electric connection between the at least one first contact element () of the first circuit carrier () and the corresponding second contact element () designed as a contact spring is established in the plug receptacle ().

Control device for a motor vehicle and related method for mounting a control device for a motor vehicle

A method for producing an electrical resistor, in particular a current sensing resistor, on a substrate, a resistor blank being placed on the substrate and then being heat-treated to form the resistor. To form the resistor blank, a palladium layer is applied to the substrate and a silver layer is applied to the palladium layer, or a silver layer is applied to the substrate and a palladium layer is applied to the silver layer, and the palladium of the palladium layer is then completely alloyed with the silver of the silver layer by heat treatment.

Method for producing an electrical resistor on a substrate

In a method for producing a conductive coating on an insulating substrate, at least one surface of an electrically insulating substrate is equipped, in selected regions, with a coating of an electrically highly conductive first metal; the coated surface is cleaned; the coating made of the first metal on the substrate is seeded with seeds of a second metal; a layer of the second metal is deposited onto the layer thus seeded; the substrate thus coated is fired.

Method for producing a conductive coating on an insulating substrate

In a ceramic hybrid substrate and a method for treating the surface of a ceramic hybrid substrate having ceramic surface areas and metallic surface areas, the ceramic surface areas are esterified.

Method for selectively coating ceramic surfaces

Pressure sensor having at least one connector element arranged flush

A high-dielectric lead-free paste serves for the manufacture of at least one area having a high dielectric constant in a ceramic multilayer circuit. The lead-free dielectric paste is basically made of barium titanate nano powder of a suitable particle size and sinters at temperatures below 1000.degree. C., preferably in a range of 800.degree. C. to 1000.degree. C.

Dielectric paste

A ceramic multilayer circuit and a method for manufacturing a ceramic multilayer circuit which has economical, corrosion-resistant external contacts or external conductor paths that are immune to the Kirkendall effect and can be utilized for different mounting processes. The circuit structure and the method involve the use of a pure silver paste to implement external conductor paths or external contacts. Corrosion resistance is ensured by a thin metallic protective layer.

Method for manufacturing ceramic multilayer circuit

Process for producing a ceramic multilayer substrate

In a method, which permits the application of porous plates inside of multilayered ceramic structures, dense regions are formed in the edge areas of the porous plates. The dense regions prevent fluids, gases and vapors from penetrating to the inside of the multilayered ceramic structure.

Method of manufacturing multilayered ceramic structures

Mounting unit for a multilayer hybrid circuit having power components

In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.

Method for producing a multilayer circuit

An electromagnetic compatibility (EMC) filter used in a hybrid technology circuit component, having current-carrying lines and a ground conductor, for protection against electromagnetic interference. The current-carrying lines and ground conductor are arranged on a ceramic plate. The current-carrying lines are covered by a dielectric, which in turn, is covered by an upper metal screen in electrical contact with the ground conductor. A lower metal screen is arranged on the ceramic plate beneath the current-carrying lines and is in electrical contact with the ground conductor.

Electromagnetic compatibility filter utilizing inherently formed

An electrical circuit unit, particularly for motor vehicles, features a grounded housing (1) and a printed circuit board (2) which, for protection against incoming and outgoing radiation of electrical noise, is short-circuited at high frequencies to the grounded housing. For this purpose, a noise suppression capacitor (6) on the PC board (2) is connected in series to a second capacitor. This second capacitor is formed by a metallized surface (8) on the board (2) and a metal-filled adhesive, as a first plate, a metal inner surface (11) of the housing (1) as a second plate, and an intermediate passivation or eloxal layer serving as a dielectric (13). The metal-filled adhesive acts to electrically bridge most of the gap between the metallized surface (8) and the housing surface (11), thereby capacitively coupling the metal-filled adhesive to the housing (1) and increasing the capacitance.

Electric circuit unit

Growing community of inventors

Reutlingen, Germany

Walter Roethlingshoefer