General Electric Company

Atlantic Richfield Company

Walter O Pillar

Adolph V DiGiulio

Alvin R Ingram

Harold A Wright

Robert E Belke, Jr

Louis Zakraysek

Kenneth D Thom

Disclosed are improved laminates useful in the manufacture of multi-layer printed wiring boards (MLPWB) and laminates. Such improved composites contain at least one layer which is formed from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(paraphenylene benzobisoxazole), poly(2,5-benzothiazole), poly(2,5-benzoxazole), and mixtures thereof. The presently preferred liquid crystal polymer comprises poly(para-phenylene benzobisthiazole). The negative coefficient of thermal expansion and high modulus of elasticity of the liquid crystal polymers enable a laminate and MLPWB to be manufactured therefrom having a tailored coefficient of thermal expansion, broadly ranging from about 0 to 15 ppm/.degree. C. MLPWBs constructed of polymeric core layers also are possible utilizing the preferred liquid crystal polymers of the present invention.

Tailorable multi-layer printed wiring boards of controlled coefficient

Styrenic polymer expandable beads that are useful in forming heat-resistant foamed articles are prepared by forming an aqueous suspension of initial styrenic polymer beads and adding thereto a portion of a comonomer solution of styrenic monomer and methacrylic acid, which solution also contains a polymerization regulator, forming an emulsion of catalyst, monomer solution and polyvinyl alcohol suspending agent, adding portions of the emulsion to the suspension and then adding the remainder of the comonomer solution to the suspension, and the suspension with added monomers is heated to copolymerize the styrenic monomer and methacrylic acid about the initial beads and form a coating about the beads.

Process for producing coated styrenic polymer beads for heat resistant

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New Hartford, NY, United States of America

Walter O Pillar