Esec Sa

Walter Nehls

Claudio Meisser

Armin Felber

Hans Eggenschwiler

Emanuele Japichino

A method, and apparatus for performing the method, for the ultrasonic contacting wired connection of electrical circuits to metallic leadframe strips, which apparatus essentially includes a bonding head with the energy transducer located thereon for feeding to the process point of the leadframe strip and for producing a longitudinal vibration amplitude is supplied with a first voltage, the bonding head is associated a measuring head fixed to a machine base, and the measuring head has an optical/electrical sensor which measures the instantaneous amplitude of the longitudinal vibration of the infeed of the bonding head and determining a correction factor mathematically from the measured quantities obtained, and the first ultrasonic value for the vibration amplitude of the energy transducer is calibrated with the correction factor.

Method and apparatus for measuring the vibration amplitude on an energy

An apparatus for performing an exact in-feed in the X and/or Y direction in the plane of a bond head, e.g. a gripper, to a working station containing a sliding plate, a support element, a first and second drives for performing the in-feeds, a guide mechanism provided with a slide part and a guide part and an integrated measuring device for determining movements of the support element oriented in the X and/or Y direction. The support element is mounted in the horizontal plane with translational and rotational degrees of freedom by a vacuum-pressurizable air bearing on the sliding plate and vertically by a vacuum-pressurizable air bearing on the slide part, the latter additionally being mounted with a vacuum-pressurizable air bearing on the sliding plate and with a counterpressure air bearing between two webs of the guide part.

Apparatus for performing in-feed of working member to working station

The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34'). The axis (S) passes through the center of the recess (45) and interconnects the two studs (35, 35' ).

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Steinhausen, Switzerland

Walter Nehls