Schott Glas

Sico Technology Gmbh

Sico Jena Gmbh Quarzschmelze

Walter Nadrag

Andreas Menzel

Frank Coriand

Siegfried Egner

Peter Jochmann

Wolfgang Schmidt

Edith Zimmermann

Bentsian Elkin

Klaus Sivec

Jorge Toro Santamaria

The present invention concerns a device () for the photochemical treatment of a liquid medium, the device () having at least one flow channel () for the liquid medium to pass through, said flow channel being delimited at least in sections by a UV-light-emitting surface () of at least one UV-light-producing body (). The at least one UV-light-producing body () is designed such that the passing liquid medium can be electrically contacted and replaces at least one electrode for producing the UV light in the device ().

Device for the photochemical treatment or cleaning of a liquid medium

In a method for producing a streak-free quartz glass sheet with a highly homogeneous degree of refraction, a quartz glass rod is lowered into a melting pot parallel to a longitudinal axis of the quartz glass rod. A cross-section of the melting pot is larger than a cross-section of the quartz glass rod and determines a contour of the quartz glass sheet. The quartz glass rod is heated in the melting pot to a flow temperature whereupon the quartz glass rod is lowered until the quartz glass rod melts and a height of the quartz glass flowing in the melting pot reaches a desired quartz glass sheet thickness. The melting pot and the quartz glass rod move relative to each other in a direction which is perpendicular to the longitudinal axis of the quartz glass rod during the melting process. Preferably, the movement involves a rotational and a transverse movement.

Method and device for producing a homogenous sheet of quartz glass without streaks

A process for the production of a device is disclosed which is suitable for holding semiconductor disks (wafers) during diverse, preferably thermal, machining processes and for transporting semiconductor disks between different machining stations and which is formed of a plurality of individually pre-manufactured device parts that are assembled and connected with one another. The invention is further directed to a holding device for semiconductor disks which is manufactured by the production process according to the invention. In a process of the type described above, the device parts are first pre-manufactured separately and independent from one another from single-crystal or polycrystalline silicon and, in so doing, are provided with fitting surfaces which correspond to one another. The adjacent device parts with opposite fitting surfaces are then joined one inside or against the other and the fitting surfaces are connected with one another by diffusion welding and/or by soldering, wherein germanium powder is used as solder.

Process for the production of a holding device for semiconductor disks and holding device produced by this process

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Bad Bleiberg, Austria

Walter Nadrag