Westinghouse Electric Corporation

Walter M Downs

Michael J Ankrom

A circuit trace/solder pad interface for closely spaced circuit traces is presented in which solder must be deposited to form a solder pad upon the circuit trace and the solder not migrate onto the circuit trace upon solder reflow. Through the intentional selection of solderably incompatible metals for the circuit trace and the solder pad, the solder pad may be isolated from the circuit trace thereby retaining solder on the pad. Furthermore a method for fabricating this circuit trace/solder pad interface is presented.

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Lutherville, MD, United States of America

Walter M Downs