Lucent Technologies Inc.

Agere Systems Guardian Corp.

Walter J Picot

Nagesh R Basavanhally

Behzad Davachi Mottahed

Daniel Plaza

Richard Sander Costa

Nandakumar G Aakalu

Girard Sidone

Gihyun Cho

Charles Joseph Buondelmonte

Peter J Massa

Joseph A Borowiec

Scott Allen Bergman

Anthony J Gaeta

Nuri Murat Cercioglu

George Michael Wenger

Iris A Artaki

Marsha M Regn

A printed wiring board assembly is formed by mounting an insert having a pocket containing one or more standoffs in the cavity of a pallet. The pallet and the insert are both coupled to the bottom of a printed wiring board. A device having tinned leads and a tinned casing is positioned in the pocket of the insert above the standoffs. A solder preform is positioned in the pocket of insert, beneath the casing of the device. The assembly is placed in a soldering oven and heated to a at least a reflow temperature of the solder preform, whereby the device casing is joined to the insert and the device leads are coupled to solder pads on the printed wiring board.

Apparatus and method for solder attachment of high powered transistors to base heatsink

An enclosure protects electronic equipment from physical contact and electromagnetic interference. The enclosure includes a base portion which is attachable to a circuit board and which surrounds all sides of the electronic equipment. A cover is attachable to the base in order to cover the top of the electronic equipment. The cover is attachable to the base by snap-in tangs formed on the base which cooperate with projections formed on the cover. The base is attachable to the circuit board by snap-in fasteners formed on the base. The base and the cover are made of a material which reflects and/or absorbs EMI. The EMI shielding enclosure protects the electronic equipment and allows access to the electronic equipment for replacement or repair without having to take the time to manipulate separate mechanical fasteners.

EMI shielding enclosure

A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the pallet and a second portion that is bonded to the bottom surface of the printed wiring board so that the insert is movable, relative to the pallet, in a plane parallel to the PWB. In one embodiment, the pallet includes an opening having a first portion and a second portion that is larger than the first portion, and the first and second portions of the insert fit at least partially in the respective first and second portions of the pallet opening. In another embodiment, the insert has a thickness that is equal to or greater than the thickness of the pallet.

Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage

A thermal conductor having electromagnetic interference shielding capabilities for electronic components. The conductor comprises a conductive strip and a support surface connected to the conductive strip. The conductive strip provides thermal conductivity and EMI shielding to the electronic components. The support surface maximizes the area of thermal contact between the conductive strip and the electronic component thereby maximizing the thermal conductivity of the conductor.

Flexible thermal conductor with electromagnetic interference shielding

An enclosure containing heat generating electrical components is provided with exterior heat fins and is enclosed within a perforated cover. The heat fins are generally planar and parallel to define vertical channels between adjacent pairs of fins. The fins are formed with a plurality of aligned notches to define a plurality of horizontal channels. The perforations in the cover are arrayed along a plurality of horizontal lines, with at least one of the horizontal lines overlying each of the horizontal channels.

Heat dissipating structure for an electrical assembly

A grounding member for installation between a surface acoustic wave filter package and a circuit board to which the filter package is mounted. The grounding member is formed from electrically conductive sheet stock material as a leaf spring which is deformed to maintain effective contact between the outer case of the filter package and a ground plane on the circuit board. In addition to providing an effective ground connection between the filter package and the ground plane, the grounding member also functions as an electromagnetic shield for radiating signals between the input signal post and the output signal post of the filter package.

Ground and shield for a surface acoustic wave filter package

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Boonton Township, NJ, United States of America

Walter J Picot