Schering Aktiengesellschaft

Chemcut Corporation

Atotech Deutschland Gmbh

Walter J Meyer

Daniel L Goffredo

Horst Blasing

Thomas Kosikowski

Rudolf Kreisel

Ludwig Mankut

Heinrich Meyer

Conrad D Shakley

Joseph M Brady

Klaus Gedrat

Franz R Cordes

Burkhard Bressel

Klaus H Gedrat

Horst Blaising

Horst Blaesing

The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.

Process for metallization of a nonconductor surface

The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid having an acid dissociation constant, for loss of a proton in aqueous solution, between 0.1 and 0.01, and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.

Process for metallization of a nonconductor surface, especially on a

Objects such as for example printed circuit boards are transported for treating through a treatment container which accommodates a treating medium in a lower plane being supported by clamps of object supports, and then the object supports with the clamps are returned to a starting position in an upper plane.

Device for and method of treating objects, particularly printed circuit

Cleaning, activating and metallizing of bore holes in conductor boards is performed by supplying a liquid treatment medium in form a standing wave onto a lower side of the conductor board by a surge line which is formed as a nozzle arranged under a transporting path and substantially normal to a transporting direction of the horizontally guided conductor board.

Method of and arrangement for cleaning, activating and metallizing of

A device for guiding plate-shaped objects to be electro-plated through an electro-plating bath in a container, includes a device transporting said objects to the container in a horizontal position, a device for pivoting the objects in the bath from a horizontal position about a horizontal axis so that the objects assume a position below the mirror of the bath. The pivoting device guides the objects through the container and, at the outlet thereof, pivots the objects back to the horizontal position.

Method of and device for guiding plate-shaped objects

A device for electroplating electric circuit boards includes an electroplating bath and a plurality of transporting organs which hold objects to be treated when they path the electroplating bath. The transporting organs are pairs of clamping yokes arranged on a common endless rotating belt and positionable from a clamping position in which they engage the object being treated and a release position in which they release said object.

Device for the electroplating treatment of plate-shaped objects

A process and apparatus is provided whereby metal is deposited onto articles such as plastics, ceramics and the like for producing printed circuit boards, metal plated ceramics, shielded articles and other plated articles, as part of a generally or substantially continuous process. Prior to plating, also as part of a continuous process while the boards are being generally continuously and horizontally conveyed in horizontal orientation, they are prepared to accept copper on their non-metallic portions, by application of a chemical reducing solution thereto, preferably after previously having been provided with a chemical activation solution thereto. Then the boards are transferred to a vertical orientation and conveyed in vertical orientation through an electroless copper deposition bath, at a reduced rate of travel, during with a copper solution adheres to the thus treated non-metallic portions of the boards, and to the metallic portions of the boards as well. After the plating process is completed in the bath, the boards are preferably retransferred to generally horizontal orientation and conveyed through appropriate completion steps, such as cleaners, rinsers, anti-tarnish steps, dryer steps and the like, with preferably uniform thin copper coatings thereon, and thereafter the boards are subsequently plated with a thicker copper coating, preferably by means of an electroplating process.

Process and apparatus for plating onto articles

Articles which require the removal of an adhering substance, such as residue of a galvanizing bath, are rinsed by spraying an aqueous rinsing agent against them repeatedly. Each spraying interval is followed by a run-off interval during which the sprayed-on rinsing agent can run off the articles. The length of the run-off intervals is equal to, or greater than, the length of the spraying intervals.

Rinsing of articles to remove an adhering substance

An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces. Solution flow through the electrolyte path is provided on a continuous basis, and both agitates and replenishes the electrolyte solution. Dams are created at ends of the flow path, by the action of squeezing rollers, to prevent passage of electrolyte. Wipers are provided for preventing the turbulence of newly-delivered electrolyte in the bath zone from immediately contacting the contact wheels. Other features are also provided.

Electroplating apparatus and method

An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces. Solution flow through the electrolyte bath is provided on a continuous basis, and both agitates and replenishes the electrolyte solution. Dams are created at ends of the flow path, by the action of squeezing rollers, to prevent passage of electrolyte. Wipers are provided for preventing the turbulence of newly-delivered electrolyte in the bath zone from immediately contacting the contact wheels. Other features are also provided.

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Berlin, Germany

Walter J Meyer