Ebm-papst St. Georgen Gmbh & Co Kg

Papst Licensing Gmbh & Co. Kg

Papst-motoren Gmbh & Co Kg

Walter Georg Angelis

Wolfgang Laufer

Siegfried Seidler

Wolfgang Arno Winkler

Francisco Rojo Lulic

Norbert Weisser

Armin Fleig

Christian Thren

Alexander Jordan

In this method, a refrigerant () is compressed () in a refrigerating circuit, then condensed by cooling in a condenser (), then expanded in a throttle valve () and delivered in the expanded state, in the form of wet vapor (), to an evaporator () that is in thermally conductive contact with a substrate () to be cooled. The cooling process thus operates similarly to a liquid cooling process, but with a higher mean logarithmic heat transfer temperature difference, which allows lower temperatures of the substrate () to be achieved and makes possible a better heat transition coefficient, since the refrigerant is present as wet vapor. A corresponding arrangement is likewise described.

Method and arrangement for cooling a substrate, especially a semiconductor

An apparatus may include a heat exchanger and an equalizing vessel for equalizing changes in coolant volume. The heat exchanger may include an inflow for delivering coolant to the heat exchanger and an outflow for discharging coolant from the heat exchanger. The equalizing vessel may be closed off by a flexible membrane that follows changes in volume of the coolant. The equalizing vessel may include a first chamber that is in liquid communication with the inflow of the heat exchanger and a second chamber that is in liquid communication with the outflow of the heat exchanger. A filter may also be provided to filter the coolant.

Apparatus including a heat exchanger and equalizing vessel

Method and arrangement for cooling a substrate, particularly a semiconductor

An arrangement, for heat dissipation from a component that is to be cooled, features: a pump for pumping a coolant, which pump comprises a pump rotor; a fan that comprises a fan rotor associated with which is an electric motor to drive it, the pump rotor and the fan rotor being separated from one another in fluid-tight fashion and drivingly connected to one another via a magnetic coupling. A corresponding method for heat dissipation from a component that is to be cooled, uses a fan having a fan rotor and a drive motor, a pump having a pump rotor, a coolant that is pumpable by means of the pump, to perform the steps of A) imparting a rotational motion to the fan rotor by means of the drive motor; B) imparting a rotational motion to the pump rotor via the magnetic coupling; and C) causing the coolant to flow by the rotational motion of the pump.

Arrangement and method for removing heat from a component which is to be cooled

A heating unit for a vehicle features a radial fan () having a housing (), which housing has an air inlet () and an air exit opening (). The heating unit has an air-directing device () that guides an air flow in a pressure chamber () of the housing () to the exit opening (). Arranged in the housing () is a radial fan wheel () that serves to generate a flow from the air inlet () via the pressure chamber () to the air exit opening (). Also provided is an electrical heating element, e.g. a PTC (Positive Temperature Coefficient) heating element (), that serves to transfer heat to the air flow generated by the fan. Air-directing elements () are provided between the exit opening () and the heating element (), in order to generate an air flow having a more uniform () velocity distribution.

Heating unit

Cooling unit

A ventilator housing of a ventilator has a flow passage having an intake opening and an outlet opening. Outflow contouring devices are arranged about the outlet opening and are configured to at least reduce a vortex formation within a shearing layer that is generated during operation of the ventilator so as to surround an actual airflow of the ventilator and that is located between the airflow and surrounding air. The outflow contouring devices enlarge the proportion of uninterrupted air flow relative to the entire flow cross-section of the flow passage.

Growing community of inventors

St. Georgen, Germany

Walter Georg Angelis