Elenza, Inc.

Walter Doll

Urban Schnell

Jean-Noel Fehr

Ronald D Blum

Amitava Gupta

Jean-Christophe Roulet

Roland Michaely

Many modern implantable ophthalmic devices include electronic components, such as electro-active cells, that can leak harmful substances into the eye and/or surrounding tissue. In the implantable ophthalmic devices disclosed herein, electronic components are hermetically sealed within cavities formed by bonding together two or more glass wafers. Bonding the glass wafers together with laser fusion bonding, pressure bonding, or anodic bonding creates a seal that leaks at a rate of less than about 5&#xd7;10Pa mswhen subjected to a helium leak test. Hermetically sealed feedthroughs formed of conductive material running through channels in the wafers provide electrical connections to components inside the sealed cavities. In some cases, the conductive material has a coefficient of thermal expansion (CTE) that is roughly equal to (e.g., within 10% of) the CTE of the glass wafers to minimize leakage due to thermally induced expansion and contraction of the conductive material and the glass wafer.

Hermetically sealed implantable ophthalmic devices and methods of making same

Ophthalmic devices with dynamic electro-active elements offer variable optical power and/or depth of field that restore lost accommodation in individuals suffering from presbyopia or aphakia. An illustrative device senses physiological processes indicative of the accommodative response and actuates a dynamic electro-active element to provide the desired change in optical power and/or depth of field. The illustrative device includes two application-specific integrated circuits (ASICs) for processing the accommodative response and actuating the electro-active element: a high-voltage ASIC that steps up a low voltage from a power supply to a higher voltage suitable for actuating the electro-active element, and another ASIC that operates at low voltage (and therefore consumes little power) and controls the operating state of the high-voltage ASIC. Because each ASIC operates at the lowest possible voltage, the illustrative ophthalmic device dissipates less power than other ophthalmic devices.

Ophthalmic devices and methods with application specific integrated circuits

Many modern implantable ophthalmic devices include electronic components, such as electro-active cells, that can leak harmful substances into the eye and/or surrounding tissue. In the implantable ophthalmic devices disclosed herein, electronic components are hermetically scaled within cavities formed by bonding together two or more glass wafers. Bonding the glass wafers together with laser fusion bonding, pressure bonding, or anodic bonding creates a seal that leaks at a rate of less than about 5&#xd7;10Pa mswhen subjected to a helium leak test. Hermetically sealed feedthroughs formed of conductive material running through channels in the wafers provide electrical connections to components inside the sealed cavities. In some cases, the conductive material has a coefficient of thermal expansion (CTE) that is roughly equal to (e.g., within 10% of) the CTE of the glass wafers to minimize leakage due to thermally induced expansion and contraction of the conductive material and the glass wafer.

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Bern, Switzerland

Walter Doll