Kulicke and Soffa Investments, Inc.

Kulicke and Soffa Industries, Inc.

Walt VonSeggern

Andrew F Hmiel

Rakesh Batish

C Scott Kulicke

Glenn Sandgren

Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.

System for reducing or eliminating semiconductor device wire sweep

A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

System and method for reducing or eliminating semiconductor device wire sweep

A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements. The method also includes curing the insulative material.

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New Hope, PA, United States of America

Walt VonSeggern