Omron Corporation

Sumitomo Rubber Industries Limited

Wakahiro Kawai

Yukio Nakao

Yoshiki Iwamae

Takafumi Bessho

Masaru Kijima

Masanobu Okada

Kazuyuki Otake

Tetsuya Katsuragawa

Noriaki Sato

When a specification setting unit sets a specification of a lot number 'k+1' after setting a specification of a lot number 'k', a mounting program selector performs a mounting program corresponding to the lot number &#x201c;k&#x201d;, and then selects a mounting program corresponding to the lot number &#x201c;k+1&#x201d; according to matching between a mounting number from the mounting program and a planned number of products of the lot number &#x201c;k&#x201d;. A printing program selector selects a printing program corresponding to the lot number &#x201c;k&#x201d;, and then selects a printing program corresponding to the lot number &#x201c;k+1&#x201d; according to matching between a sum of a printing number from the printing program and a defective product number and the planned number of products of the lot number &#x201c;k&#x201d;. Consequently, on-demand production of an electronic device can easily be manufactured on a manufacturing line.

Control device

A method of manufacturing a relay includes a molded resin element step configured to produce a molded resin element with an IC chip is embedded therein by injecting a resin around the IC chip; an assembly step configured to apply the molded resin element to a base material as an exterior jacket component of the relay, the base material serving as the main body of the relay; and an antenna wiring forming step configured to print an antenna wiring on a surface of the molded resin element, the antenna wiring configured to allow the IC chip to perform wireless communication.

Method of manufacturing product, exterior jacket component and antenna pattern selection device

This method for manufacturing a resin structure () is provided with: a step for arranging a sheet () having a smooth surface () having a maximum height roughness of 3 &#x3bc;m or less, inside a forming mold () such that the smooth surface () faces an internal space () of the forming mold (); a step for molding a resin molded body () to which the sheet () is adhered, by filling the internal space () with a resin; a step for separating the resin molded body () from the sheet (), thereby forming a first region () having a maximum height roughness of 3 &#x3bc;m or less on at least a portion of the surface of the resin molded body (); and a step for using a fluid conductive ink to form a wiring () on the first region ().

Method for manufacturing resin structure, and resin structure

An electronic device comprises: an electronic component; a resin molded body in which the electronic component is embedded and fixed; and a bendable bend portion continuous with the resin molded body. For example, the bend portion is molded integrally with the resin molded body. Thus, electronic device can be reduced in size and thickness.

Electronic device and method for manufacturing the same

Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step difference near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD () and an IC () are embedded and exposed in a resin molding () in such a manner that a connection electrode () of the LCD () and an electrode of the IC () are positioned on the same plane.

Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor

An electronic device includes electronic components, a molded resin element wherein the electronic components are embedded and secured, and a heat transfer layer; the heat transfer layer has a higher thermal conductivity than the molded resin element. The heat transfer layer is in contact with portions of the electronic components other than an electrode pad and a terminal. This prevents increases in the cost of manufacturing the electronic device and the allows the electronic device to be thinner.

Electronic device and method of manufacture therefor

The present invention limits measurement error and sensor element damage. When a contact-type sensor () is placed in contact with skin (), a gap () is formed between the skin () and a sensor element (). The contact-type sensor () is provided with a water-repellent resin base plate () and a water-absorbing sheet () that, together with the skin () and the sensor element (), surround the gap ().

Contact-type sensor

A resin structure includes a molded resin element and a push-type switch. The push-type switch includes a receptacle whereon a first terminal and a second terminal are secured, the first terminal and the second terminal configured to connect to an electrical circuit; a button unit protruding from the receptacle; and a contact spring unit configured to move with the button unit, to electrically connect between the first terminal and the second terminal, and to generate an opposing force relative to a pressure applied between the receptacle and the button unit. The receptacle stores the button unit and the contact spring unit. The receptacle of the push-type switch is embedded in the molded resin element with the button unit exposed from the molded resin element.

Resin structure, electronic device, and method of manufacturing resin structure

A simulation apparatus has a type setting section that sets a type of mode of electric power consumption of equipment, and an output section that simulates an amount of the electric power consumption of the equipment in accordance with the type set by the type setting section and outputting the amount of electric power consumption thus simulated.

Electric power consumption simulation device, simulation method, and recording medium

This electronic device is provided with: a resin molding; and a conductive cable including an electric wire. One end portion of the conductive cable is embedded in the resin molding. The surface of the resin molding exposes an end surface on the side of the one end portion of the conductive cable and includes a surface which is continuous to the end surface. The electronic device is further provided with wirings formed on the end surface and the surface so as to be connected to the electric wire in the end surface.

Electronic device and manufacturing method thereof

An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. A thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.

Resin-molded electronic device with disconnect prevention

In order to be more compact and thin, this light emitting device includes LED elements embedded in a resin molded body such that light emitting units are exposed on a lateral surface of the resin molded body and positive electrodes and negative electrodes are exposed on a back surface which is perpendicular to the lateral surface of the resin molded body.

Light emitting device, backlight device, and manufacturing method of light emitting device

The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (A) includes at least one high frequency functional component (), an electrically conductive member () which electromagnetically shields the at least one high frequency functional component (), and a resin molded body () in which at least part of the high frequency functional component () and at least part of the electrically conductive member () are embedded and fixed.

Electronic device and method for producing same

Provided is a circuit structure in which the occurrence of wiring line breakage due to deformation of a resin molded body is suppressed. A circuit structure () includes an electronic component () having an electrode (), a resin molded body () in which the electronic component () is embedded, and a wiring line () connected to the electrode (). A groove () is formed around the electronic component () in the resin molded body (), and the wiring line () is provided so as to extend into the groove ().

Circuit structure

Provided is a plate spring fixing structure and the like which do not necessitate complex assembling processes and thus can reduce production cost and can be reduced in size, and which enable adjustment, during a production process, of the extent to which the plate spring is bent. A holding structure (A) includes a first plate spring () that has: a fixed portion () embedded in and fixed to a first molded resin part (); and a spring portion () which is not fixed and which has a spring property. The fixed portion () has a face that is not in contact with the first molded resin part ().

Growing community of inventors

Kyoto, Japan

Wakahiro Kawai