Taiyo Yuden Co., Ltd.

Wakaaki Murai

Fumi Mori

Fuyuki Miyazawa

A ceramic electronic component includes a multilayer chip having a structure in which dielectric layers and internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the internal electrode layers being alternately exposed to two surface regions of the multilayer chip, and external electrodes, each of which is provided on each of the two surface regions. At least a part of each of the external electrodes has a first metal layer contacting the multilayer chip and a plated layer provided on the first metal layer. The first metal layer includes a first metal and a second metal having a Young's modulus smaller than that of the first metal.

Ceramic electronic device and manufacturing method of the same

A multilayer ceramic capacitor includes an element body. The element body includes a stack of first internal electrode layers, dielectric layers and second internal electrode layers. The element body has a first surface and a second surface opposite the first surface. The multilayer ceramic capacitor also includes a first external electrode formed on the first surface of the element body and a second external electrode formed on the second surface of the element body. The first internal electrode layer has a first current path extending in a first plane perpendicular to the first surface such that the first current path has a shorter component on the first plane in a first direction toward the first surface than in a second direction perpendicular to the first direction. The second internal electrode layer has a second current path that possesses a similar anisotropy to the first internal electrode layer.

Multilayer ceramic capacitor and method of manufacturing same

A ceramic electronic part which includes a ceramic part body substantially in a parallelepiped form and having a first outer electrode at one end portion thereof and a second outer electrode at an opposite end portion thereof. The first outer electrode contiguously includes a main part provided on one surface in the third direction of the ceramic part body and a sub part provided on one surface in the first direction of the ceramic part body, and the second outer electrode contiguously includes a main part provided on one surface in the third direction of the ceramic part body and a sub part provided on an other surface in the first direction of the ceramic part body. The ceramic electronic part suffers warpage causing first and second maximum gaps to occur between the main parts of the outer electrodes in the second direction and a virtual plane.

Ceramic electronic part and method for manufacturing the same

Disclosed is a ceramic electronic component having external electrodes on each of opposing ends of a rectangular parallelepiped ceramic component body incorporating a functional portion. Facing directions of two opposing faces, other two opposing faces, and remaining two opposing faces of the ceramic component body are defined as first, second, and third directions, respectively, and dimensions along the respective directions are defined as first to third direction dimensions. Under this condition, the external electrode is of a two-face type continuously including a first face portion disposed on one face in the first direction and a second face portion disposed on one face in the third direction. A main layer portion of a protective portion is disposed on another face in the third direction and a first wraparound portion of the protective portion is disposed continuously with the main layer portion on each of the two faces in the second direction.

Ceramic electronic component, manufacturing method of ceramic electronic component, and electronic component-mounting circuit board

A ceramic electronic part which includes a ceramic part body substantially in a parallelepiped form and having a first outer electrode at one end portion thereof and a second outer electrode at an opposite end portion thereof. The first outer electrode contiguously includes a main part provided on one surface in the third direction of the ceramic part body and a sub part provided on one surface in the first direction of the ceramic part body, and the second outer electrode contiguously includes a main part provided on one surface in the third direction of the ceramic part body and a sub part provided on an other surface in the first direction of the ceramic part body. The ceramic electronic part suffers warpage causing first and second maximum gaps to occur between centers in the second direction of the main parts of the outer electrodes and a virtual plane.

An optical recording medium is provided having a recording layer that absorbs light with a wavelength of 350 nm to 500 nm, the optical recording medium having good recording playback properties even when the ambient temperature changes, and allowing playback distortion to be controlled even when stored in a high temperature environment. A write-once type optical recording medium including: a substrate; a reflective layer that reflects light with a wavelength of 350 nm to 500 nm on the substrate; a recording layer that absorbs light with a wavelength of 350 nm to 500 nm; and a light transmission layer with a single-layer construction that transmits light with a wavelength of 350 nm to 500 nm, the light transmission layer having a modulus of elasticity at 75&#xb0; C. that ranges from 50 MPa to less than 170 MPa.

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Tokyo, Japan

Wakaaki Murai