Apple Inc.

Wai Man Raymund Kwok

Eric Steven Jol

Ashutosh Yugesh Shukla

Jared Mitchell Kole

Daniel C Wagman

Amy Qian

James A Wright

Todd K Moyer

Yi Zhang

James A Yurko

Joel N Ruscher

Liquan Tan

Daniel T McDonald

Marco Soldano

Blake R Marshall

Hani Esmaeili

Reza Nasiri Mahalati

Melissa A Wah

Victor Luzzato

Zechariah D Feinberg

Herng-Jeng Jou

Hoishun Li

Vincent Yan

Andrea L Blakemore

Katie L Sassaman

A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

Nanotwin copper components

An electronic device includes a housing coupled to a display window, a battery and a plurality of inductive charging transmit coils coupled to the battery. The plurality of inductive charging coils are positioned within the enclosure to generate an inductive charging region that extends through the display window and across at least a portion of an exterior of the display window. Sensing circuitry is configured to sense a position of a stylus at the display window and a processor is configured to selectively engage and disengage one or more of the plurality of inductive charging transmit coils based on the sensed position of the stylus. The stylus receives power when it is positioned within the inductive charging window.

Electronic device having an inductive charging system

Embodiments of the disclosure pertain to methods of plating magnets with a stack of layers such that the resulting magnet assembly has improved corrosion resistance. Embodiments of the disclosure are also directed to magnet assemblies formed by such methods. Some embodiments include a High Phosphorus Electroless Nickel (HiPEN) layer with Phosphorus content greater than 11% by weight.

Corrosion resistant magnet assembly

An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.

High strength, high conductivity electroformed copper alloys and methods of making

Coatings for magnetic materials, such as rare earth magnets, are described. The coatings are designed to reduce or prevent the release of one or both of nickel and cobalt from the coatings or from the underlying magnetic material. The coatings are designed to resist corrosion and release of nickel and cobalt when exposed to moist conditions. The coatings are also designed to be robust enough to withstand damage due to scratch forces. In some embodiments, the coatings include multiple layers of one or of metal and non-metal materials. The coated magnets are well suited for use in the manufacture of wearable consumer products.

Magnet electroplating

Coatings for filling cracks within anodic films formed from, for example, a laser marking process are described. The cracks generally have widths of nanometers in scale and can extend from an external surface of an anodic film to an underlying metal substrate. The coatings fill the cracks to prevent liquid and contaminants from entering the cracks and reaching the metal substrate, thereby preventing corrosion of the underlying metal substrate. The coatings can be hydrophobic such that water is wicked away from the cracks. In some cases, the coatings are fluoropolymer coatings. Methods include spray-on techniques that provide a thin and uniform layer of the coating. The spray-on technique can be configured to spray on a fluoropolymer precursor onto the anodic film such that the fluoropolymer precursor diffuses into and polymerizes into the fluoropolymer coating within the cracks.

Methods for applying a coating over laser marking

Growing community of inventors

Hong Kong, China

Wai Man Raymund Kwok