Pyxis Cf Pte. Ltd.

Wai Hoe Lee

Amlan Sen

Qing Feng Guan

Chian Soon Chua

Hwee Seng Chew

Li Jiang Huang

Siew Wen Lee

Kin Fei Chooi

A die bonding apparatus having: a carrier support unit having at least one support element defining a supporting plane and a carrier holder operable to support the carrier panel on a side of the supporting plane with the carrier panel being parallel to the supporting plane, a wafer feed unit having a wafer holder operable to hold a diced wafer in a manner so as to space the diced wafer apart from the supporting plane defined by the at least one support element of the carrier support unit and orient the diced wafer with an exposed surface of the diced wafer facing the side of the supporting plane to which the carrier panel is supported, and a die transfer module disposed between the carrier support unit and the wafer feed unit, the die transfer module operable to transfer a die from the diced wafer to the carrier panel.

Apparatus and method for bonding a plurality of dies to a carrier panel

Panel level packaging (PLP) with high positional accuracy of dies. The PLP bonds dies accurately to die bonding regions of an alignment panel. High accuracy is achieved by providing die bonding regions with local alignment marks. Accurate die bonding on the alignment carrier results in a reconstructed wafer with accurate positioning of dies. The dies of the reconstructed wafer can be scanned by a die location check (DLC) scan based on sub-blocks of dies, enabling high DLC throughput. The DLC scan generates a DLC file with coordinate points of sub-blocks of the reconstructed wafer. Also, a laser direct imaging (LDI) file can be generated using sub-block circuit files aligned to the DLC file. The use of sub-block circuit files facilitates high throughput in generating the LDI file with high accuracy due to the reconstructed wafer being formed using the alignment carrier with local alignment marks.

Precision reconstruction for panel-level packaging

Panel level packaging (PLP) with high accuracy and high scalability is disclosed. The PLP includes dies bonded face down onto an alignment carrier configured with die bond regions. Pre-bond and post bond inspection are performed at the carrier level to ensure accurate bonding of the dies to the carrier.

Post bond inspection of devices for panel packaging

Growing community of inventors

Singapore, Singapore

Wai Hoe Lee