Excelitas Technologies Corp.

Wai Choi

Wei Li

Scott Carpenter

Sergey Kudaev

Mikhail Melnik

Robert Olma

A sealable laser diode heat sink module for a laser diode includes an anode assembly and a cathode assembly having a cathode base and a cathode connector plate. The anode assembly includes an anode base configured to house the laser diode and the cathode base within a sealable cavity recessed into the anode base. The anode base has a cathode base opening configured to receive the cathode connector plate. An anode connector plate extends from the anode base. An anode current path passes through the laser diode and the anode connector plate via direct connections through the anode base. A cathode current path passes through the cathode connector plate passes via direct connections through the cathode base. The anode base is configured to dissipate heat from the laser diode.

Sealed laser diode heat sink module

A light mixing and folding lamp includes an LED assembly with two or more LED chips that direct light into the ingress end of a light mixing rod. The light mixing rod is positioned to pass through an aperture in a concave second reflecting element, and mixed light emerges from the egress end of the light mixing rod, where it is directed toward a first reflecting element positioned near a focal point of the second reflecting element. The first reflecting element reflects mixed light emerging from the egress end of the light mixing rod, folding the mixed light back toward a concave reflecting surface of the second reflecting element. The second reflecting element reflects light from the first reflecting element forward, where the light emerges from the lamp directed toward a subject to be illuminated.

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Schaumburg, IL, United States of America

Wai Choi