International Business Machines Corporation

Globalfoundries Inc.

Wagdi William Abadeer

William R Tonti

Robert J Gauthier, Jr

Jed Hickory Rankin

Kiran V Chatty

John Atkinson Fifield

Jeffrey Scott Brown

Anthony Richard Bonaccio

Yun Shi

Robert Russell Robison

Harold Pilo

Albert Manhee Chu

Joseph Andrew Iadanza

Eric Adler

Patrick R Hansen

Jonathan M McKenna

Jack Allan Mandelman

George Maria Braceras

John P Connor

Daryl Michael Seitzer

Edward J Nowak

Sebastian Theodore Ventrone

Wayne Frederick Ellis

David Michael Fried

Edward W Sengle

Lilian Kamal, Legal Representative

Carl John Radens

Toshiharu Furukawa

James William Adkisson

Zhong-Xiang He

Eduard Albert Cartier

Tom C Lee

Michael Joseph Zierak

Vidhya Ramachandran

Ethan Harrison Cannon

Josef S Watts

Bradley Alan Orner

Badih El-Kareh

James H Stathis

Duane E Galbi

Michael J Hauser

Jason E Cummings

Dennis T Cox

Barbara Ann Waterhouse

Nathan R Hiltebeitel

Jeffrey P Gambino

John J Ellis-Monaghan

Louis Lu-Chen Hsu

Robert Allen Groves

Donald Albert Evans

Stephen Dale Wyatt

Cathryn Jeanne Christiansen

Jennifer E Appleyard

Dimitris P Ioannou

Robert J Gauthier

Lillian Kamal, Legal Representative

Robert J Gauthler, Jr

John A Fitfield

Jed H Rankin, Jr

Various aspects include extremely thin semiconductor-on-insulator (ETSOI) layers. In one embodiment, an ETSOI layer includes a plurality of shallow trench isolations (STI) defining a plurality of distinct semiconductor-on-insulator (SOI) regions, the distinct SOI regions having at least three different thicknesses; at least one recess located within the distinct SOI regions; and an oxide cap over the at least one recess.

Extremely thin semiconductor-on-insulator (ETSOI) layer

A system and a method for measuring temperature within an operating circuit use a Wheatstone bridge within a temperature sensing circuit. One of the resistors in the Wheatstone bridge is a thermally sensitive resistive material layer within the operating circuit. The other three resistors are thermally isolated from the operating circuit. Particular configurations of NFET and PFET devices are used to provide enhanced measurement sensitivity within the temperature sensing circuit that includes the Wheatstone bridge.

Thermal sensor for semiconductor circuits

A method of increasing an initial threshold voltage (Vt) of selected devices. The method includes designing devices with desired antenna effects and adjusting an increase in Vt of some devices to specific values. The desired antenna effects produce a desired threshold voltage of the devices.

Structure, design structure and process for increasing magnitude of device threshold voltage for low power applications

A field effect transistor (FET) that includes a drain formed in a first plane, a source formed in the first plane, a channel formed in the first plane and between the drain and the source and a gate formed in the first plane. The gate is separated from at least a portion of the body by an air gap. The air gap is also in the first plane.

Field effect transistor with air gap dielectric

A solution for alleviating variable parasitic bipolar leakages in scaled semiconductor technologies is described herein. Placement variation is eliminated for edges of implants under shallow trench isolation (STI) areas by creating a barrier to shield areas from implantation more precisely than with only a standard photolithographic mask. An annealing process expands the implanted regions such their boundaries align within a predetermined distance from the edge of a trench. The distances are proportionate for each trench and each adjacent isolation region.

Method of generating uniformly aligned well and isolation regions in a substrate and resulting structure

Solutions for forming an extremely thin semiconductor-on-insulator (ETSOI) layer are disclosed. In one embodiment, a method includes providing a wafer including a plurality of semiconductor-on-insulator (SOI) layer regions separated by at least one shallow trench isolation (STI); amorphizing the plurality of SOI layer regions by implanting the plurality of SOI layer regions with an implant species; and removing a portion of the amorphized SOI layer region to form at least one recess in the amorphized SOI layer region.

Forming an extremely thin semiconductor-on-insulator (ETSOI) layer

A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a first structure for determining a non-linear characteristic of the input voltage to the output frequency response, the first design structure providing a tunneling-based current relationship with the input voltage. Also disclosed is a system and a method of implementing such structure.

Structure for transforming an input voltage to obtain linearity between input and output functions and system and method thereof

Disclosed are embodiments of a semiconductor wafer processing method that allow device regions to be selectively annealed following back end of the line (BEOL) metal wiring formation without degrading wiring layer reliability. In the embodiments, a semiconductor device is formed adjacent to the top surface of a wafer such that it incorporates a selectively placed infrared absorbing layer (IAL). Then, following BEOL metal wiring formation, the bottom surface of the wafer is exposed to an infrared light having a wavelength that is transparent to the wafer. The infrared light is absorbed by and, thereby heats up the IAL to a first predetermined temperature (e.g., a dopant activation temperature, a temperature required for a state change, etc.). The resulting heat is transferred from the IAL to an adjacent region of the semiconductor device without raising the temperature of the metal wiring above a second predetermined temperature (e.g., a temperature that could degrade the metal wiring) that is lower than the first predetermined temperature.

Semiconductor wafer processing method that allows device regions to be selectively annealed following back end of the line (BEOL) metal wiring layer formation

In one embodiment, a second metal line embedded in a second dielectric layer overlies a first metal line embedded in a first dielectric layer. A portion of the second dielectric layer overlying the first metal line is recessed employing a photoresist and the second metal line as an etch mask. A doped semiconductor spacer is formed within the recess to provide a resistive link between the first metal line and the second metal line. In another embodiment, a first metal line and a second metal line are embedded in a dielectric layer. An area of the dielectric layer laterally abutting the first and second metal lines is recessed employing a photoresist and the first and second metal lines as an etch mask. A doped semiconductor spacer is formed on sidewalls of the first and second metal lines, providing a resistive link between the first and second metal lines.

Methods for forming back-end-of-line resistive semiconductor structures

In one embodiment, a back-end-of-line (BEOL) resistive structure comprises a second metal line embedded in a second dielectric layer and overlying a first metal line embedded in a first dielectric layer. A doped semiconductor spacer or plug laterally abutting sidewalls of the second metal line and vertically abutting a top surface of the first metal line provides a resistive link between the first and second metal lines. In another embodiment, another BEOL resistive structure comprises a first metal line and a second metal line are embedded in a dielectric layer. A doped semiconductor spacer or plug laterally abutting the sidewalls of the first and second metal lines provides a resistive link between the first and second metal lines.

Back-end-of-line resistive semiconductor structures

Structures and methods for integrating a thick oxide high-voltage metal-oxide-semiconductor (MOS) device into a thin oxide silicon-on-insulator (SOI). A method of forming a semiconductor structure includes forming first source and drain regions of a first device below a buried oxide layer of a silicon-on-insulator (SOI) wafer, forming a gate of the first device in a layer of semiconductor material above the buried oxide layer; and forming second source and drain regions of a second device in the layer of semiconductor material above the buried oxide layer.

High-voltage SOI MOS device structure and method of fabrication

Disclosed are embodiments of a variable-delay field effect transistor (FET) having multiple source regions that can be individually and selectively biased to provide an electrical connection to a single drain region. Delay is a function of which of the multiple source regions is/are selectively biased as well as a function of gate resistance and capacitance. Such a variable-delay FET can be incorporated into a phase adjusting circuit, which uses gate propagation delays to selectively phase adjust an input signal. The phase adjusting circuit can be tuned by incorporating non-salicided resistances and additional capacitance at various positions on the gate structure. The phase adjusting circuit can further be modified into a phase adjusting mixer circuit that enables a phase adjusted signal to be combined with an additional signal.

Multiple source-single drain field effect semiconductor device and circuit

In a first aspect, a first apparatus is provided. The first apparatus is a memory element that includes (1) one or more MOSFETs each including a dielectric material having a dielectric constant of about 3.9 to about 25; and (2) control logic coupled to at least one of the one or more MOSFETs. The control logic is adapted to (a) cause the memory element to operate in a first mode to store data; and (b) cause the memory element to operate in a second mode to change a threshold voltage of at least one of the one or more MOSFETs from an original threshold voltage to a changed threshold voltage such that the changed threshold voltage affects data stored by the memory element when operated in the first mode. Numerous other aspects are provided.

Memory elements and methods of using the same

Disclosed is a method of executing an electrical function, such as a fusing operation, by activation through a chip embedded photodiode through spectrally selected external light activation, and corresponding structure and circuit. The present invention is based on having incident light with specific intensity/wave length characteristics, in conjunction with additional circuit elements to an integrated circuit, perform the implementation of repairs, i.e., replacing failing circuit elements with redundant ones for yield and/or reliability. Also to perform disconnection of ESD protection device from input pad one the packaged chip is placed in system. No additional pins on the package are necessary.

On demand circuit function execution employing optical sensing

Growing community of inventors

Jericho, VT, United States of America

Wagdi William Abadeer