Shipley Company LLC

Rohm and Haas Company

Rohm & Haas Electronic Materials LLC

Wade W Sonnenberg

Gordon L Fisher

Roger F Bernards

Mark J Kapeckas

Patrick J Houle

James G Shelnut

Leon Barstad

Erik Reddington

Thomas Buckley

John J Bladon

Andrew J Cobley

Thong B Luong

Jeffrey P Burress

David Oglesby

Raymond Cruz

Eugene N Step

John P Cahalen

Egon Matijevic

Robert L Goldberg

Gary Hamm

David L Jacques

Joseph R Montano

Robert A Binstead

Edward J Cerwonka

Inna Sinitskaya

Christopher P Esposito

Gordon Fischer

Stewart Fisher

Jennifer Patricia Canlas

Matthias Schultz

James L Aubry

David R Gabe

Elie H Najjar

Trevor Goodrich

Katie Price

Leon R Barstad

John Edward Graves

Trevor Goodrick

Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.

Bath analysis

A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

Plating bath and method for depositing a metal layer on a substrate

A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.

Conductive polymer colloidal compositions with selectivity for non-conductive surfaces

Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Plating bath analysis

A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.

A method for treating a micro-roughened metal surface to improve bonding between the metal surface and a polymer material. The method involves post-treating the micro-roughened conversion coated metal surface with an aqueous wetting agent composition after having formed the micro-roughened conversion coated metal surface with an adhesion promotion composition. The method can be employed in the circuit board industry to improve bonding between layers in multilayer circuit boards.

Process for treating adhesion promoted metal surfaces

A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.

Low VOC, dielectric compositions suitable for use in circuit board manufacture are disclosed. Also disclosed are methods of making circuit boards using the low VOC, dielectric compositions.

Dielectric composition

This invention is directed to a process for the selective metallization which utilizes multiple photoresist layers, using a buried palladium ligand which is then catalyzed using a PdBr selective catalyst. The Pd in the catalyst is then reduced to Pd,and metallized using for example electroless copper.

Metallization process and component

A method of providing an electrically conductive polymer coating on a copper clad circuit board prior to electroplating is disclosed. The method teaches the application of certain organic solvents to a conductive polymer composition already applied to the board but before drying the conductive polymer composition to remove liquids therefrom to form a conductive polymer film.

Method of manufacture of multilayer circuit boards

The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic--lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.

Method for electroplating using stabilized dispersions of conductive

A microetch composition for a circuit board containing sulfuric acid in combination with a carboxylic acid having 2 to 6 carbon atoms, wherein the volume of the carboxylic acid is preferably greater than the amount of sulfuric acid. The method discloses the contacting of a electrically conductive polymer with the microetch composition disclosed above to expose copper underlying the electrically conductive polymer.

Method of microetching a conductive polymer on multilayer circuit boards

The invention relates to a metal sulfide dispersion used for electroplating nonconductors such as substrates used for the formation of a printed circuit board. A printed circuit board made using the dispersion could have metallized through-holes comprising electrodeposited copper on the walls of the holes with an adsorbed layer of metal sulfide particles between the circuit board base material and the copper on the walls of the through-holes. The metal sulfide is characterized by spherical particles having a mean diameter of less than 100 nanometers and a particle size distribution where less than 10 percent of the particles within the dispersion have a diameter twice that of the mean diameter of all particles within the dispersion.

Electroplating process and composition

The invention relates to a conductive dispersions used for diverse purposes such a base for electroplating nonconductors. The dispersion are characterized by use of a stabilizing quantity of a stabilizer having repeating alylkene oxide groups and a hydrophilic-lipophilic balance in excess of 12. It has been found that the stabilizers utilized in the subject compositions does result in a significant loss of conductivity in coatings formed from the dispersion.

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Upton, MA, United States of America

Wade W Sonnenberg