Hewlett-packard Development Company, L.p.

Hewlett Packard Enterprise Development LP

Compaq Information Technologies Group, L.p.

Wade David Vinson

John P Franz

Joseph R Allen

Troy Anthony Della Fiora

Tahir Cader

David W Sherrod

Jeffery Michael Giardina

Rich Bargerhuff

Chandrakant D Patel

David W Deis

Douglas Kent Garday

Christopher Gregory Malone

Christian Laszlo Belady

George D Megason

Robert B Curtis

Matthew Richard Slaby

Yousef M Jarrah

Thomas D Rhodes

Ernesto Ferrer

Arthur G Volkmann

Ronald D Noblett

Kevin B Leigh

Eric C Peterson

Paul R Culley

David F Heinrich

David Allen Moore

Thomas T Hardt

Everett R Salinas

Paul E Westphall

Alan B Doerr

Daniel T Thompson

David M Paquin

Chong Sin Tan

William Kirk Norton

Arthur K Farnsworth

Zheila N Madanipour

Eric Mei

Stephen Kay

Thomas G Bumby, Jr

Michael E Taylor

Egons Dunens

Nicholas Holian

Gerald E Laws

Jeffrey M Giardina

Steve Novack

Art Volkmann

Christopher A Taylor

In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.

Air and liquid cooling of electronic equipment based on a selected hybrid cooling profile

An apparatus is provided herein. The apparatus includes a sensor module and a control module. The sensor module to receive a measured environmental condition. The control module to use the measured environmental condition to determine a fluid temperature to cool a first set of components and determine an air temperature to cool a second set of components.

Air and fluid cooling of a data center

Hot-pluggable optical modules for high-density optical signaling are provided. The modules comprise a dual-purpose heat spreader configured to function as a thermal component and including trenches accommodating optical infrastructure. The dual-purpose heat spreader includes a trench for routing optical fibers to and from a plurality of optical connectors, each disposed on a branch of the fiber harness assembly and configured to mate with a socket on a module board through an opening in the dual-purpose heat spreader.

Electro-optical hot-pluggable module with a dual-purpose heat transfer plate

The present disclosure provides a system including a cooling rack for servers, a first enclosure, and a second enclosure. The first enclosure can be coupled to the cooling rack for servers and houses electronics. The second enclosure can be coupled to the cooling rack for servers beneath the first enclosure with a minimal sliding clearance in between the two enclosures. The second enclosure also holds an electronics cartridge and connects to the cooling rack for servers via a slide that enables the second enclosure to slide out from under the first enclosure so that the electronics cartridge can be removed from a top of the enclosure. Further, the second enclosure may contain a fluid to immerse components and absorb heat from the electronics cartridge.

Cooling rack

A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.

A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system.

Modular cooling

Examples described herein relate to adiabatic cooling units. For example, a method for mixing gases within an adiabatic cooling unit includes allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. The method includes allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. The method also includes creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.

Adiabatic cooling unit

Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.

An intelligent air moving apparatus for cooling an electronics enclosure includes a motor for driving a fan at a variable rotational speed and a microcontroller for controlling the rotational speed of the motor. The microcontroller includes a speed sensor for sensing the rotational speed such that when the sensed rotational speed deviates below a target speed, the microcontroller detects a locked rotor condition.

Intelligent air moving apparatus

Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.

Cooling assist module

A cooling fan having motor and an impeller. The cooling fan may comprise a three-phase DC motor. The impeller may comprise a hub to house the three-phase DC motor and a plurality of blades extending from the hub. Each blade may have a height that is at least 25 % of the impeller diameter.

Cooling fan for electronic device

In accordance with at least some embodiments, a computer system includes an enclosure () configured to hold at least one resource unit (). The computer system also comprises a plurality of mixed-flow ducted fans units () selectively attached to the enclosure (). Each mixed-flow ducted fan unit () comprises a duct () having an intake diameter, a bellmouth diameter, and an exhaust diameter. The bellmouth diameter is less than the intake diameter and the exhaust diameter.

Mixed-flow ducted fan

An electronic module includes an enclosure having a front face and a rear face. An electronic circuit board is positioned in the enclosure and a processor is mounted to the electronic circuit board. A data storage device is positioned in the enclosure such that the processor is positioned between the data storage device and the electronic circuit board.

Component layout in an enclosure

A computer-implemented method is used for determining cooling requirements of a computer system enclosure, where the enclosure includes a number of installed modules, the modules including fan modules. The method includes the steps of determining an individual impedance curve of each installed module; determining fan curves for the installed fan modules; based on the individual impedance curves, determining an overall system impedance curve for the computer system; determining desired performance requirements for the computer system; based on the desired performance requirements, determining corresponding fan curves; and choosing a fan curve that intersects the system impedance curve.

Method for determining cooling requirements of a computer system enclosure

In certain embodiments, an air-pressurizing device is positioned to discharge a computer system. A supply conduit pneumatically couples a cooled-air discharge conditioning system with an inlet of the air-pressurizing device.

System and method for cooling computers

Growing community of inventors

Magnolia, TX, United States of America

Wade David Vinson