Xilinx, Inc.

W Scott Bogden

Vincent L Tong

Edwin W Resler

Russell C Swanson

An interface assembly in the present invention includes a plate for mounting a test head, a plurality of alignment pins for aligning the test head to a device including a plurality of compressible pins, and a plurality of vacuum-activated components for coupling the plate to the device. After the test head is positioned in operative relation to the other device, the vacuum-activated components provide a vacuum which draws the plate and the device together. The interface assembly eliminates the purely mechanical securing of the plate to the device, thereby minimizing any rocking of the test head and ensuring equal compression of the plurality of compressible pins. The interface assembly also ensures safe user operation by providing that any obstacle (such as a user's finger) between the interface assembly and the device prevents creation of a vacuum. Thus, the present invention provides a time-efficient, reliable, safety-conscious means for positioning a test head relative to another device.

Test head interface with vacuum-activated interconnection components

A method in accordance with the present invention includes programming a plurality of semiconductor devices simultaneously, thereby dramatically increasing the number of devices programmed within a predetermined time. In one embodiment, this method includes arranging a first plurality of semiconductor devices into an array configuration. The first array is then programmed while a second plurality of semiconductor devices is arranged into the array configuration. The second array is then programmed, while the first array is unloaded and a third plurality of semiconductor devices is arranged into the array configuration. The present invention further includes the step of moving the first plurality of semiconductor devices in the array configuration to a programming position and the step of transferring the first plurality of semiconductor devices to an unloading position. The steps of moving or transferring includes providing a vacuum, mechanical pick-up, or magnetic pick-up for moving the semiconductor devices. In one embodiment, the step of loading is performed by a first arm capable of three dimensional movement, and the step of unloading is performed by a second arm capable of three dimensional movement independent of the first arm. In this embodiment, the step of moving or transferring is performed with a dual head array mechanism capable of moving independently from the first and second arms.

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San Martin, CA, United States of America

W Scott Bogden