Input/output, Inc.

W Marc Stalnaker

Duli Yu

Howard D Goldberg

Arjun Selvakumar

James L Marsh

Lianzhong Yu

Peter Maxwell

Axel Michael Sigmar

Lawrence Philip Behn

Matthew W Ip

Thomas M Buie

Guido Lemke

David Morgan

Kees Faber

Sjoerd Altman

Richard Laroo

Larry Rushefsky

Ray Rinne

Demetrios Balderes

Klaus Domagalski

A sensor apparatus () includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module () supported by a planar surface () within a cavity () of a housing () coupled to a first end cap () by a PC-board connection (). Housing () is further coupled to first end cap () by a first coupling member () and a second coupling member () and is also coupled to an opposite second end cap () by a third coupling member () and a fourth coupling member (). Interface sealing members () seal between housing () and first end cap (). Interface sealing members () seal between housing () and second end cap ().

Integrated and multi-axis sensor assembly and packaging

A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

Low stress die attachment

Growing community of inventors

Sugar Land, TX, United States of America

W Marc Stalnaker