Sundstrand Corporation

Hamilton Sundstrand Corporation

Sunstrand Corporation

W Kyle Anderson

Stephen E Jackson

Arthur A Pershall

Mark W Metzler

Richard J Hoppe

Curtis B White

Lee L Thomas

Frank W Allen, Iii

Robert J Sterling

William J Durako, Jr

Randall M Ekstrom

Lawrence Hughes

A semiconductor package includes a plurality of semiconductor devices disposed in an array surrounding a central electrode structure carried by a package support member. The package is capable of withstanding high voltages and currents and includes a heat exchanger integral therewith.

Package for multiple high power electrical components

A capacitor assembly which positively disconnects failing capacitors is disclosed. This assembly will disconnect electrical power from a capacitor when internal pressure builds up inside the capacitor as a result of an internal short circuit. One or more capacitors are connected electrically into a circuit. Terminals are fixedly connected at each end of the capacitor. The protruding ends of the terminals slidably couple the capacitor to a source of alternating current (AC) power. The normal failure mode for capacitors is to develop internal short circuits. The failed capacitor then heats up rapidly and generates internal pressure. This pressure deforms the end portion of the capacitor. When the end of the capacitor moves in a longitudinal axis of motion, the slidable connection of the terminal is moved to a non-contacting position and the electrical connection is interrupted.

Capacitor disconnecting assembly

A connector includes a first end for floating securement to a circuit board such that the connector can move within a range of motion, a second end including a socket for receiving a pin of a bus bar and a conductor for electrically interconnecting the socket and the circuit board.

Connector for interconnecting a bus bar to a circuit board

The present invention is an improved filter assembly for providing at least common-mode filtering. A filter assembly in accordance with the present invention includes a plurality of spaced apart electrical conductors (102) for carrying at least common-mode electrical current; a housing (104) electrically isolated from the plurality of electrical conductors and containing a portion of a length of the plurality of electrical conductors, the housing having an interior cavity (104) defined by a wall (112) having at least a partially electrically conductive section (114), the wall extending outward from two longitudinally spaced apart locations on the plurality of electrical conductors and between the plurality of electrical conductors at a position spaced from the plurality of electrical conductors to form the cavity; at least one inductive element (108) in a closed lower reluctance loop extending around the plurality of electrical conductors and electrically isolated therefrom and the electrically conductive portion of the wall to provide an inductance common to the plurality of electrical conductors; and at least one capacitive element (110), each capacitive element having an electrical contact with the electrically conductive portion of the wall and the plurality of electrical conductors to provide capacitance between the plurality of electrical conductors and the electrically conductive portion of the wall.

Common-mode EMI filter

A capacitor has first and second pin contacts. A first female contact receives the first pin contact of the capacitor, and a second female contact receives the second pin contact of the capacitor. Electrical contact is established between the first and second pin contacts and the corresponding first and second female contacts. The first and second female contacts are in corresponding first and second displaced planes.

Support for capacitor

A clamping arrangement for an electronic package includes a supporting means for supporting an electronic package and a clamping means for clamping the electronic package to the supporting means. The clamping means includes a plurality of springs between a clamping plate and a load distribution plate for evenly applying forces from the clamping plate to the load distribution plate to press the electronic package against the supporting means.

Electronic package clamping arrangement

A mounting arrangement of the present invention is provided for packaging a plurality of multiple layer capacitors together. First and second coupling devices are coupled electrically to respective first and second electrodes of each multiple layer capacitor of the plurality of multiple layer capacitors. A clamping devices clamps the first and second coupling devices, the plurality of multiple layer capacitors, and an electrically insulating layer to a mounting surface so that the electrically insulating layer is between the first coupling devices and the mounting surface and so that the plurality of multiple layer capacitors are electrically connected in parallel between the first and second coupling devices.

Multiple layer capacitor mounting arrangement

A power semiconductor assembly, particularly a semiconductor switch assembly which has a number of discrete emitter connection pads, comprised of a metal matrix composite housing and a copper or aluminum post with a cross-sectional area sufficiently large to carry the rated current providing a single-point, external connection to all emitter pads. The post passes through and is supported by an insulating ceramic insert such as aluminum oxide in the wall of the metal matrix composite housing. The post is hollowed out in the region where it passes through the ceramic insert in order to reduce the mechanical stress between the post and the insulating insert as a result of the mismatch in their thermal expansion coefficients. Buses on either side of the semiconductor die provide surfaces for connection from the post to the discrete emitter connection pads on the die.

Metal matrix composite semiconductor power switch assembly

A package for a high power electrical component includes a base and a plate disposed on a support surface of the base and having an electrically insulative layer and an outer layer having a conductive portion thereon. An electrically conductive pad is disposed on the electrically conductive portion of the plate and the electrical component is disposed on the pad. A cover is disposed atop the base and encloses the plate, the pad and the electrical component. First and second electrically conductive terminals extend through apertures in the cover and are electrically coupled to the electrodes of the electrical component. The cover is hermetically sealed to the base and to the first and second terminals. The coefficient of thermal expansion of the base and cover are substantially equal to minimize stresses developed therein.

Package for a high power electrical component

The problem of preloading a rotor assembly (14) in a dynamoelectric machine (10) of the permanent magnet type is solved by providing a hub (20) having a plurality of outwardly opening, annularly spaced slots (22, 24). The slots are outwardly converging and separated by outwardly diverging partition portions (26) of the hub. A plurality of outwardly converging permanent magnets (30) respectively are disposed in the slots. A containment shell (32) surrounds the hub. Wedges (36) are inserted between the base of each permanent magnet and the bottom (24) of its respective slot for loading the permanent magnets radially outwardly toward the containment shell and against the sides of the slots, thereby to place the partition portions of the hub under tension in a static condition of the rotor assembly.

Preloaded permanent magnet rotor assembly

A switch assembly (60) shielded against electromagnetic interference in accordance with the present invention includes a first housing (15) defining a volume within which a switch (16) is disposed and a first opening not providing shielding against electromagnetic interference penetrating into the volume (39) through which at least two electrical conductors (12) pass which are electrically connected to the switch, the first housing providing shielding against electromagnetic interference penetrating into the volume through the wall; a cable (44) shielded against electromagnetic interference, attached to a cover plate (65) with the at least two conductors being contained within the cable, the cover plate shielding against penetration of electromagnetic interference; a second housing (62) deposed outside of, contacting and containing the first housing, the second housing defining a second opening (64) not providing shielding against penetration of electromagnetic interference into the second housing; and the cover plate being joined to the second opening by an attachment (68) which shields against penetration of electromagnetic interference into the second housing.

Growing community of inventors

Rockford, IL, United States of America

W Kyle Anderson