Corning Incorporated

Uab Altechna R&d

Vytautas Sabonis

Garrett Andrew Piech

Paolo Di Trapani

Sasha Marjanovic

Ralf Joachim Terbrueggen

Reinhard Moritz Malchus

Mindaugas Mikutis

Valdemaras Juzumas

Manoj K Bhuyan

Ottavia Jedrkiewicz

Manoj Kumar Bhuyan

A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tof 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater.

Methods for laser processing transparent workpieces using modified pulse burst profiles

A method and system for laser pre-cutting a layered material () with a laser beam () is disclosed. The layered material () comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL, CSL), and at least one interface region (IR, IR) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL, CSL) and is transparent to allow propagation of the laser beam () through the layered material (). The method may comprise setting an optical beam path () and a laser characteristic of the laser beam () such that an interaction of the laser beam () with the layered material () generates an elongate damage region () in the layered material (), and, for each of a series of pre-cut positions (X, X, X) of the layered material (), pre-cutting the layered material () by positioning the layered material () and the laser beam () with respect to each other and irradiating the laser beam () such that the respective elongate damage regions () extend across the at least one interface region (IR, IR).

High speed laser processing of transparent materials

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Vievis, Lithuania

Vytautas Sabonis