Apple Inc.

Vu Thanh Vo

Dennis R Pyper

Amir Salehi

David A Pakula

Daniel William Jarvis

Ian A Spraggs

Gregory N Stephens

Meng Chi Lee

Derek J Walters

Alex J Crumlin

Wyeman Chen

Michael Victor Yeh

Corey S Provencher

Jun Zhai

Brad W Simeral

Steven P Cardinali

Lin Chen

Flynn P Carson

Lan H Hoang

Shakti Singh Chauhan

Albert Wang

Chang Liu

Paul Aurelio Martinez

Scott D Morrison

Siddharth Nangia

Derek J DiCarlo

Curtis C Mead

Takayoshi Katahira

Giancarlo F De La Cruz

Gregory A Fosnes

The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

Stacked printed circuit board packages

Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.

Low-profile space-efficient shielding for SIP module

A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.

Stacked circuit board architecture in an electronic device

Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.

Reduced electrical terminations in surface-mount technology components

Sensors modules adapted to be mounted to a motherboard under challenging conditions by using automated manufacturing processes are disclosed. A sensor module can include a sensor mounted to a sensor PCB, a connector coupled to the sensor and having a plurality of guide pins extending therefrom in a vulnerable manner, with the guide pins being adapted to be inserted into guide pin holes on an associated motherboard, and a disposable carrier adapted to hold the connector and protect the guide pins thereof prior to mounting. The disposable carrier is removed from the sensor module before the sensor module is mounted directly to a motherboard by press-fitting the guide pins into guide pin holes on the motherboard and soldering connections thereto in an automated surface mounting operation. Disposable carrier protected sensor modules can be stored and processed in a tray or tape-and-reel automated manufacturing system.

Printed circuit board sensor mounting and alignment

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Salinas, CA, United States of America

Vu Thanh Vo