Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Airbus Operations Gmbh

Thin Materials Ag

Airbus Deutschland Gmbh

Nissan Chemical Corporation

Schwering & Hasse Elektrodraht Gmbh

Volkmar Stenzel

Martin Kaune

Andreas Jakob

Klaus-D Vissing

Klaus Dieter Vissing

Matthias Ott

Ottmar Schramm

Wolfgang Bremser

Andreas Hartwig

Silke Grünke

Guido Ellinghorst

Gabriele Neese

Yvonne Wilke

Georg Niedzwiedzki

Steffen Schrübbers

Andreas Brinkmann

Walter Hügle

Hubertus Lohner

Marta Raquel Da Silva Branco Cheta

Claus Schreiner

Jörg Ressel

Martin Metzner

Volker Föste

Gesa Pazelt

Stefan Baumann

An aircraft landing flap includes a flap member having an abrasion-resistant coating coated on an abrasion region exposed to mechanical rubbing contacts with an aircraft spoiler. The coating comprises a polyurethane matrix based on aliphatic components and fillers embedded in the polyurethane matrix so as to increase resistance to abrasion.

Aircraft landing flap

A method of protecting a part of a surface of an aircraft against contamination with insect residues and/or against icing is described. The method includes the following steps:

Method for protecting the surface of an aircraft against contamination with insect residues and/or icing

This invention concerns a component for a painting facility which is contaminated with paint during operation of the painting facility, e.g. a grating, a hanger, a cover and similar, characterized in that it is coated with a plasma polymeric coating containing oxygen, carbon and silicon.

Component for a painting installation and device for removing paint therefrom

A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to the wafer and adheres more strongly to the carrier layer than to the wafer.

Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer

A tool is described for generating a microstructured surface, comprising:

Tool for generating microstructured surfaces

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Thedinghausen, Germany

Volkmar Stenzel