Infineon Technologies Ag

Technologies Ag

Volker Strutz

Rainer Markus Schaller

Juergen Hoegerl

Gerold Gruendler

Thomas Killer

Erich Syri

Udo Ausserlechner

Uta Gebauer

Carsten Von Koblinski

Franz-Peter Kalz

Horst Theuss

Klaus Elian

Manfred Engelhardt

Jochen Dangelmaier

Manfred Schindler

Mario Motz

Harry Hedler

Gottfried Beer

Wolfgang Scherr

Gernot Binder

Stefan Landau

Stephan Wege

Michael Weber

Ingo Wennemuth

Rainer Steiner

Cyrus Ghahremani

Chee Voon Tan

Achim Neu

Knut Kahlisch

Hansjoerg Walter Kuemmel

Jürgen Högerl

Hui Teng Wang

Sigrid Wabnig

Diego Lunardini

Hermann Josef Lutz

Erick Syri

R&uuml;diger Uhlmann

Ronak Kalhor-witzel

Riccardo Dapretto

Robert Grünberger

A sensor device contains a busbar, a dielectric shell arranged over the busbar, a dielectric layer arranged over the busbar, and a sensor chip arranged within the dielectric shell, wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar.

Sensor devices with busbar and sensor chip and dielectrics arranged therebetween

A current sensor includes a current rail and a magnetic field sensor. The magnetic field sensor is configured to measure a magnetic field induced by a current flowing through the current rail. A first insulation layer and a second insulation layer are arranged between the current rail and the magnetic field sensor. An interface between the first insulation layer and the second insulation layer is free of a contact with the current rail and/or is free of a contact with the magnetic field sensor. A portion of the current rail extends into the second insulation layer and the portion of the current rail is encapsulated by the second insulation layer.

Current sensor that includes a current rail and a magnetic field sensor with galvanic isolation

A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.

Current sensor package with continuous insulation

What is proposed is a current sensor comprising a current rail and comprising a magnetic field sensor, wherein the magnetic field sensor is configured to measure a magnetic field induced by a current flowing through the current rail, wherein a first insulation layer and a second insulation layer are arranged between the current rail and the magnetic field sensor, wherein an interface between the first insulation layer and the second insulation layer is free of a contact with the current rail and/or is free of a contact with the magnetic field sensor.

Current sensor

A sensor device includes a current conductor designed to carry a measurement current, and a magnetic field sensor chip having a sensor element, wherein the magnetic field sensor chip is designed to detect a magnetic field at the location of the sensor element. The sensor device furthermore includes an encapsulation material, wherein the magnetic field sensor chip is encapsulated by the encapsulation material, and a soft magnet secured to the encapsulation material and designed to concentrate the magnetic field at the location of the sensor element. The magnetic field sensor chip and the soft magnet are galvanically isolated from one another by the encapsulation material.

Sensor devices having soft magnets and associated production methods

A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.

Sensor package and method for producing a sensor package

A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.

Sensor apparatuses with a bypass current path and associated production methods

A sensor device comprises a dielectric substrate, a busbar mechanically connected to the dielectric substrate, a cavity formed in the dielectric substrate, and a sensor chip arranged in the cavity, wherein the sensor chip is designed to detect a magnetic field induced by an electric current flowing through the busbar, wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.

Sensor devices with sensor chip and busbar

A sensor device comprises an electrically conductive chip carrier, wherein the chip carrier comprises an auxiliary structure, wherein the auxiliary structure comprises a first precalibration current terminal and a second precalibration current terminal, a magnetic field sensor chip arranged on a mounting surface of the chip carrier, wherein the magnetic field sensor chip comprises a sensor element, wherein the shape of the auxiliary structure is embodied such that an electrical precalibration current flowing from the first precalibration current terminal to the second precalibration current terminal through the auxiliary structure induces a predefined precalibration magnetic field at the location of the sensor element, wherein during measurement operation of the precalibrated sensor device, no precalibration current flows between the first precalibration current terminal and the second precalibration current terminal.

Sensor device with auxiliary structure for calibrating the sensor device

A sensor device comprises a busbar, a dielectric arranged on the busbar, and a sensor chip arranged on the dielectric, wherein the sensor chip is designed to measure a magnetic field induced by an electric current flowing through the busbar, wherein the surface of the dielectric facing toward the busbar is spaced from the busbar in an area along the entire periphery of the dielectric.

Sensor devices having a sensor chip and busbar

A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

Package with component connected with carrier via spacer particles

A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.

Package with component connected at carrier level

A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.

Semiconductor device for sensing a magnetic field including an encapsulation material defining a through-hole

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Tegernheim, Germany

Volker Strutz