Semitool, Inc.

Steelcase Inc.

Vladimir Zila

Daniel J Woodruff

Kyle Moran Hanson

Thomas H Oberlitner

John M Pedersen

LinLin Chen

Robert W Berner

Worm Lund

Kevin W Coyle

Wayne J Schmidt

Mark Dix

Donald P Gravel

Douglas L Hancey

The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

Modular semiconductor workpiece processing tool

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Methods and apparatus for processing the surface of a microelectronic workpiece

A partition for open building space and the like having a frame including at least one substantially horizontal surface. A cover member is configured to enclose at least a portion of the frame. The cover member includes attachment members configured to connect the cover member to the frame. A seal is attached to the cover member and includes a resilient flap which engages the substantially horizontal surface of the frame to inhibit the passage of acoustical and/or optical energy through the partition.

Cover panel attachment system for partitions

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

Apparatus for processing the surface of a microelectronic workpiece

A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

Semiconductor processing apparatus having lift and tilt mechanism

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith. The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide/actuator comprising a fixed frame and a movable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the movable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

A workpiece support for supporting a semiconductor workpiece in a semiconductor processing machine is disclosed. The workpiece support has an operator base which essentially forms a yoke having two yoke arms. An operator arm having two fork arms is pivotally mounted between the two yoke arms of the operator base such that the fork arms are protruding. A processing head having a workpiece holder is rotatably mounted between the two protruding fork arms. The processing head may rotate about the fork arms to present the workpiece holder in a position to receive a workpiece or to deploy the workpiece in the semiconductor manufacturing process. The operator arm which pivots about the operator base yoke arms is used to lower the processing head and the workpiece into the process. Both the processing head and the operator arm are supported along horizontal axes having at least two points of support distally separated for stability. The processing head is further provided with novel fingers for holding the workpiece in an electroplating process. A method of presenting a workpiece to a semiconductor manufacturing process in accordance with the description provided for the apparatus is also described.

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Toronto, Canada

Vladimir Zila