Visteon Global Technolgoies, Inc.

Visteon Global Tech., Inc

Vladimir Stoica

Andrew Zachary Glovatsky

Mohan R Paruchuri

Lawrence LeRoy Kneisel

Lakhi Nandlal Goenka

Jay DeAvis Baker

Vivek Amir Jairazbhoy

Achyuta Achari

Brenda Joyce Nation

Robert Joseph Gordon

Vivek Jairazboy

Vivek Amir Jalrazbhoy

An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.

Assembly comprising multiple microelectronic modules

A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipati9on of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.

Microelectronic package within cylindrical housing

A multi-layer electronic circuit board designhaving selectively formed apertures or cavities, and which includes grooves or troughswhich are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures

Electrical circuit board and a method for making the same

A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

Microelectronic package with tubular housing

A multi-layer electronic circuit board design having selectively formed apertures or cavities , and which includes grooves or troughs which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures

A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Cladded material construction for etched-tri-metal circuits

A method for making multi-layer electronic circuit board including a pre-circuit assembly and a ground layer which are automatically aligned and bonded together by use of solder material or deposits

Growing community of inventors

Farmington Hills, MI, United States of America

Vladimir Stoica