United States of America as Represented by the Secretary of the Air Force

Other

Vladimir L Tassev

David F Bliss

John S Bailey

Michael J Suscavage

Gerald W Iseler

David H Tomich

Shivashankar Vangala

Rita D Peterson

A method of performing HVPE heteroepitaxy comprises exposing a substrate to a carrier gas, a first precursor gas, a Group II/III element, and ternary-forming gasses (V/VI group precursor), to form a heteroepitaxial growth of a binary, ternary, and/or quaternary compound on the substrate; wherein the carrier gas is H, wherein the first precursor gas is HCl, the Group II/III element comprises at least one of Zn, Cd, Hg, Al, Ga, and In; and wherein the ternary-forming gasses comprise at least two or more of AsH(arsine), PH(phosphine), HSe (hydrogen selenide), HTe (hydrogen telluride), SbH(hydrogen antimonide, or antimony tri-hydride, or stibine), HS (hydrogen sulfide), NH(ammonia), and HF (hydrogen fluoride); flowing the carrier gas over the Group II/III element; exposing the substrate to the ternary-forming gasses in a predetermined ratio of first ternary-forming gas to second ternary-forming gas (1tf:2tf ratio); and changing the 1tf:2tf ratio over time.

Optimized heteroepitaxial growth of semiconductors

Optimized thick heteroepitaxial growth of semiconductors with in-situ substrate pretreatment

A method of performing HVPE heteroepitaxy comprises exposing a substrate to a carrier gas, a first precursor gas, a Group II/III element, and ternary-forming gasses (V/VI group precursor), to form a heteroepitaxial growth of a binary, ternary, and/or quaternary compound on the substrate; wherein the carrier gas is Hz, wherein the first precursor gas is HCl, the Group II/III element comprises at least one of Zn, Cd, Hg, Al, Ga, and In; and wherein the ternary-forming gasses comprise at least two or more of AsH(arsine), PH(phosphine), HSe (hydrogen selenide), HzTe (hydrogen telluride), SbH(hydrogen antimonide, or antimony tri-hydride, or stibine), HS (hydrogen sulfide), NH(ammonia), and HF (hydrogen fluoride); flowing the carrier gas over the Group II/III element; exposing the substrate to the ternary-forming gasses in a predetermined ratio of first ternary-forming gas to second ternary-forming gas (1tf:2tf ratio); and changing the 1tf:2tf ratio over time.

A method of performing heteroepitaxy comprises exposing a substrate to a carrier gas, a first precursor gas, a Group II/III element, and a second precursor gas, to form a heteroepitaxial growth of one of GaAs, AlAs, InAs, GaP, InP, ZnSe, GaSe, CdSe, InSe, ZnTe, CdTe, GaTe, HgTe, GaSb, InSb, AlSb, CdS, GaN, and AlN on the substrate; wherein the substrate comprises one of GaAs, AlAs, InAs, GaP, InP, ZnSe, GaSe, CdSe, InSe, ZnTe, CdTe, GaTe, HgTe, GaSb, InSb, AlSb, CdS, GaN, and AlN; wherein the carrier gas is Hz, wherein the first precursor is HCl, the Group II/III element comprises at least one of Zn, Cd, Hg, Al, Ga, and In; and wherein the second precursor is one of AsH(arsine), PH(phosphine), HSe (hydrogen selenide), HTe (hydrogen telluride), SbH(hydrogen antimonide), HS (hydrogen sulfide), and NH(ammonia). The process may be an HVPE (hydride vapor phase epitaxy) process.

A method for preparation of orientation-patterned (OP) templates comprising the steps of: depositing a first layer of a first material on a common substrate by a far-from-equilibrium process; and depositing a first layer of a second material on the first layer of the first material by a close-to-equilibrium process, wherein a first assembly is formed. The first material and the second material may be the same material or different materials. The substrate material may be AlO(sapphire), silicon (Si), germanium (Ge), GaAs, GaP, GaSb, InAs, InP, CdTe, CdS, CdSe, or GaSe. The first material deposited on the common substrate may be one or more electronic or optical binary materials from the group consisting of AlN, GaN, GaP, InP, GaAs, InAs, AlAs, ZnSe, GaSe, ZnTe, CdTe, HgTe, GaSb, SiC, CdS, CdSe, or their ternaries or quaternaries. The far-from-equilibrium process is one of MOCVD and MBE, and the close-to-equilibrium process is HVPE.

Method for fabrication of orientation-patterned templates on common substrates

A method of performing heteroepitaxy comprises exposing a substrate to a carrier gas, a first precursor gas, a Group II/III element, and a second precursor gas, to form a heteroepitaxial growth of one of GaAs, AlAs, InAs, GaP, InP, ZnSe, GaSe, CdSe, InSe, ZnTe, CdTe, GaTe, HgTe, GaSb, InSb, AlSb, CdS, GaN, and AlN on the substrate; wherein the substrate comprises one of GaAs, AlAs, InAs, GaP, InP, ZnSe, GaSe, CdSe, InSe, ZnTe, CdTe, GaTe, HgTe, GaSb, InSb, AlSb, CdS, GaN, and AlN; wherein the carrier gas is H, wherein the first precursor is HCl, the Group II/III element comprises at least one of Zn, Cd, Hg, Al, Ga, and In; and wherein the second precursor is one of AsH(arsine), PH(phosphine), HSe (hydrogen selenide), HTe (hydrogen telluride), SbH(hydrogen antimonide), HS (hydrogen sulfide), and NH(ammonia). The process may be an HVPE (hydride vapor phase epitaxy) process.

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Wakefield, MA, United States of America

Vladimir L Tassev