Bruker Nano Gmbh

Vladimir Gulkov

Nikolay Yeremin

Douglas Werner

Jair Giovanni Ramirez Gonzalez

Steven J Shaffer

Shortcomings associated with insufficient control of a conventional CMP-process are obviated by providing an CMP-apparatus configured to complement a constant force (to which a workpiece that is being polished is conventionally exposed) with a time-alternating force and/or means for measuring an electrical characteristic of the CMP-process. The time-alternating force is applied with the use of a system component that is electrically isolated from the workpiece and that is disposed in the carrier-chick in which the workpiece is affixed for CMP-process, while the electrical characteristic is measured with the use of a judiciously-configured reservoir in which the used fluid is collected. The use of such CMP-apparatus.

Chemical-mechanical polishing system with a potentiostat and pulsed-force applied to a workpiece

System for conducting measurements of friction of a chosen material with reduced errors. The system includes a sample holder, a bushing accommodating such holder while permitting reversible repositioning of the holder along a bushing axis, a horizontal force sensor, a vertical force sensor, a sample holder pusher and a subsystem including a linear vertical bearing (disposed in the bushing and separating the holder from the bushing) and/or a horizontally-sliding element between the rod pusher and the vertical force sensor. The subsystem is structured to reduce a rocking motion of the holder in the bushing caused by a relative motion between the sample and an auxiliary body brought in contact with the sample. The method for performing measurements with such system.

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San Jose, CA, United States of America

Vladimir Gulkov