General Electric Company

Vladimir Anatolievich Lobastov

Peter Michael Edic

Yannan Jin

Geng Fu

John Eric Tkaczyk

James Wilson Rose

Kevin Matthew Durocher

Daniel David Harrison

Brian David Yanoff

John Scott Price

Jianjun Guo

Abdelaziz Ikhlef

Vance Scott Robinson

David Charles Bogdan, Jr

Adrian Ivan

Haochuan Jiang

Hewei Gao

Vincent Scott Smentkowski

A system and method for monitoring and controlling build quality during electron beam manufacturing of a build part. The system may include at least one electron beam source to direct at least one electron beam onto a plurality of deposited layers of metallic powder to form a melt pool, a detector to detect in real-time backscattered energy ejected from the melt pool and indicative of a defect in the build part and generate a detection signal representative of the defect. A controller receives and analyzes the detection signal and generates a corrective signal for control of at least one of the actuator and the at least one electron beam source to direct the at least one electron beam onto the plurality of deposited layers of metallic powder to sequentially consolidate patterned portions of the plurality of deposited metallic powder layers to adaptively form the three-dimensional build part.

System and method for monitoring and controlling build quality during electron beam manufacturing

An additive manufacturing system includes a cabinet, an electron beam system, at least one imaging device, and a computing device. The cabinet is configured to enclose a component and defines a pinhole extending therethrough. The electron beam system is configured to generate an electron beam directed toward the component. Interactions between the component and the electron beam generate x-ray radiation. The at least one imaging device is configured to detect the x-ray radiation through the pinhole. The computing device is configured to image the component based on the x-ray radiation detected by the at least one imaging device.

Method and system using x-ray pinhole camera for in-situ monitoring of electron beam manufacturing process

Some embodiments are associated with an input signal comprising a first and a second photon event incident on a photon-counting semiconductor detector. A relatively slow charge collection shaping amplifier may receive the input signal and output an indication of a total amount of energy associated with the superposition of the first and second events. A relatively fast charge collection shaping amplifier may receive the input signal and output an indication that is used to allocate a first portion of the total amount of energy to the first event and a second portion of the total amount of energy to the second event.

Apparatus and method for pile-up correction in photon-counting detector

A system includes an energy-discriminating, photon-counting X-ray detector, comprising a plurality of detector cells adapted to produce projection data in response to X-ray photons and to produce an electrical signal having a recorded count for the energy bins and a total energy intensity. The system also includes data processing circuitry adapted to receive the electrical signal, to generate a simulated count rate for each of the energy bins by using the total energy intensity, to determine a set of energy intensity dependent material decomposition vectors, and, for the measured projection data, to perform material decomposition.

Systems and methods for correcting detector errors in computed tomography imaging

Detector modules for an imaging system and methods of manufacturing are provided. One detector module includes a substrate, a direct conversion sensor material coupled to the substrate and a flexible interconnect electrically coupled to the direct conversion sensor material and configured to provide readout of electrical signals generated by the direct conversion sensor material. The detector module also includes at least one illumination source for illuminating the direct conversion sensor material.

Detector modules for imaging systems and methods of manufacturing

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Waterford, NY, United States of America

Vladimir Anatolievich Lobastov