Polese Company, Inc.

Vlad Ocher

Frank J Polese

Stuart Weinshanker

David L Rose

William Dixon

Walter V Chichra

Michael J Singer

Anthony P Grodio

Jack A Rubin

Henry Escalante

A process for low cost manufacturing light-weight, heat-dissipating structures such as heatsinks, heat spreaders, and covers or lids for microelectronic components such as flip-chip integrated circuits from difficult-to-machine metal matrix composites such as aluminum silicon carbide (generically referred to as &ldquo;Al&mdash;SiC&rdquo; or &ldquo;AlSiC&rdquo;). The process involves selecting a mass produced quantity of Al&mdash;SiC material, forming that material into a thin ribbon, then stamping/coining the ribbon into the structures. The ribbon can be formed by extruding a thin strip from a billet of the Al&mdash;SiC material, then plurally rolling it. In this way, commonly available AlSiC composites manufactured in high volume for use in other applications such as cast automotive parts may be used.

Heat-dissipating aluminum silicon carbide composite manufacturing method

Growing community of inventors

San Diego, CA, United States of America

Vlad Ocher