International Business Machines Corporation

Vivekananda P Adiga

Martin O Sandberg

Hanhee Paik

Jerry M Chow

Markus Brink

Russell Alan Budd

Charles Thomas Rettner

Jared Barney Hertzberg

Jason Scott Orcutt

Richard Alan Haight

Douglas Max Gill

Sami Rosenblatt

Rasit Onur Topaloglu

David Lee Rath

Keith E Fogel

Ali Afzali-Ardakani

Jeng-Bang Yau

Stephen McConnell Gates

Elbert Emin Huang

Salvatore Bernardo Olivadese

Hongwen Yan

David C Mckay

Nicholas Torleiv Bronn

John Bruley

Sarah Elizabeth Sheldon

Benjamin B Wymore

Robert Connelly

Michael Justin Beckley

Kenneth Parker Rodbell

Arvind Kumar

Kevin Shawn Petrarca

Yves Corfield Martin

Joshua M Rubin

Dongbing Shao

Ali Afzali-ardakani

Firat Solgun

Harry Jonathon Mamin

Timothy Phung

Muir Kumph

John M Papalia

Jyotica V Patel

Cihan Kurter

A superconducting connecting system includes an anti-fuse structure. There is a first superconducting trace having a first segment that is cantilevered over a cavity a substrate. A second superconducting trace having a second segment is cantilevered over the cavity in the substrate. A first auxiliary segment is coupled to the first segment and suspended over the cavity. A second auxiliary segment is coupled to the second segment and suspended over the cavity. The first segment and the second segment face each other and have a predetermined gap therebetween. The first segment and the second segment are configured to receive an output of a laser. An amount of material of the first and second auxiliary segment is based on creating a fuse ball joint that provides an electrical short between the first superconducting trace and the second superconducting trace, upon receiving the output of the laser.

Anti-fuse and fuse structures for improving the functionality of qubit circuits

Devices and/or computer-implemented methods to facilitate a programmable and/or reprogrammable quantum circuit are provided. According to an embodiment, a device can comprise a superconducting coupler device having a superconducting fuse device that is used to alter the coupling of a first quantum computing element and a second quantum computing element.

Programmable and reprogrammable quantum circuit

A microelectromechanical system (MEMS) device and method of fabrication are provided. The MEMS devices includes a silicon substrate. The silicon substrate includes a top surface. An interconnect is machined from the silicon substrate. The interconnect includes at a spring body that has least two spring arms. Each spring arm includes a first end distal from a center of the interconnect, a second end proximate the center of the interconnect, and a single turn of a constant curvature. Each spring arm is configured to move rotationally in a plane parallel to the top surface of the silicon substrate.

Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate

A method for adjusting a resonance frequency of a qubit in a quantum mechanical device includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit comprising capacitor pads; and removing substrate material from the backside of the substrate at an area opposite the at least one qubit to alter a capacitance around the at least one qubit so as to adjust a resonance frequency of the at least one qubit.

Superconducting qubit capacitance and frequency of operation tuning

A method of constructing a superconducting switch includes depositing a thin sacrificial layer on top of a substrate. The sacrificial layer is patterned to remove portions of the sacrificial layer except at a first portion of the substrate. A superconducting metal layer is patterned on top of the substrate and on top of the sacrificial layer. The superconducting metal layer is patterned to form a superconducting metal line over the sacrificial layer. The patterned sacrificial layer is etched from under the superconducting metal line to release the metal line from the substrate.

The subject disclosure is directed towards layered substrate structures with aligned optical access to electrical devices formed thereon for laser processing and electrical device tuning. According to an embodiment, a layered substrate structure is provided that comprises an optical substrate having a first surface and a second surface and a patterned bonding layer formed on the second surface that comprises a bonding region and an open region, wherein the open region exposes a portion of the second surface. The layered substrate structure further comprises a device chip bonded to the patterned bonding layer via the bonding region and comprising at least one electrical component aligned with the optical substrate and the open region. The at least one electrical component can include for example, a thin film wire, an air bridge, a qubit, an electrode, a capacitor or a resonator.

Layered substrate structures with aligned optical access to electrical devices

Systems and techniques that facilitate trimmable inductors for qubit frequency tuning are provided. In various embodiments, a device can comprise a Josephson junction. In various aspects, the Josephson junction can be shunted by a capacitor, and a trimmable inductor can couple the Josephson junction to a pad of the capacitor. In various cases, the trimmable inductor can comprise a first conductive path that includes a severable and/or weldable superconducting bridge and a second conductive path that is in parallel with the first conductive path. In various aspects, severing and/or welding the severable and/or weldable superconducting bridge can controllably change an inductance of the trimmable inductor, which can commensurately change a resonant frequency of a qubit formed by the Josephson junction and the capacitor.

Trimmable inductors for qubit frequency tuning

A resonator is based on a coplanar waveguide (CPW) structure that includes a first end portion having a first width and configured to be coupled to a first qubit. There is a middle portion having a second width that is narrower than the first width. There is a second end portion having a third width that is wider than the second width and configured to be coupled to a second qubit.

Compact resonator with shifted higher modes for quantum buses

Devices, systems, methods, and/or computer-implemented methods that can facilitate protection of a substrate in a qubit device using sacrificial material are provided. According to an embodiment, a device can comprise a superconducting lead provided on a pillar of a sacrificial material provided on a substrate. The device can further comprise a collapsed superconducting junction provided on the substrate and coupled to the superconducting lead.

Sacrificial material facilitating protection of a substrate in a qubit device

Devices, systems, and/or methods that can facilitate local heating of a superconducting flux biasing loop are provided. According to an embodiment, a device can comprise a substrate having a superconducting flux bias circuit comprising a biasing loop coupled to a flux controlled qubit device. The device can further comprise a heating device coupled to the biasing loop.

Flux bias line local heating device

Devices, systems, and/or methods that can facilitate local heating of a superconducting flux biasing loop are provided. According to an embodiment, a method can comprise forming on a substrate a biasing loop and a flux controlled qubit device of a superconducting flux bias circuit. The method can further comprise forming a heating device on the substrate to couple the heating device to the biasing loop.

Fabrication of a flux bias line local heating device

Devices, methods, and/or computer-implemented methods that can facilitate formation of a self assembled monolayer on a quantum device are provided. According to an embodiment, a device can comprise a qubit formed on a substrate. The device can further comprise a self assembled monolayer formed on the qubit.

Self assembled monolayer formed on a quantum device

Techniques regarding encapsulating one or more superconducting devices of a quantum processor are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing a metal fluoride layer onto a superconducting resonator and a silicon substrate that can be comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the metal fluoride layer can coat the superconducting resonator.

Metal fluoride encapsulation of superconducting devices

Systems and techniques that facilitate spurious junction prevention via in-situ ion milling are provided. In various embodiments, a method can comprise forming a tunnel barrier of a Josephson junction on a substrate during a shadow evaporation process. In various instances, the method can further comprise etching an exposed portion of the tunnel barrier during the shadow evaporation process. In various embodiments, the shadow evaporation process can comprise patterning a resist stack onto the substrate. In various instances, the etching the exposed portion of the tunnel barrier can leave a protected portion of the tunnel barrier within a shadow of the resist stack. In various instances, the shadow of the resist stack can be based on a direction of the etching the exposed portion of the tunnel barrier. In various embodiments, the shadow evaporation process can further comprise depositing a first superconducting material on the substrate after the patterning the resist stack, oxidizing a surface of the first superconducting material to form the tunnel barrier, and depositing a second superconducting material over the protected portion of the tunnel barrier to form a Josephson junction. In various instances, the etching the exposed portion of the tunnel barrier can occur after the oxidizing the surface of the first superconducting material and before the depositing the second superconducting material.

Spurious junction prevention via in-situ ion milling

Growing community of inventors

Ossining, NY, United States of America

Vivekananda P Adiga