Qualcomm Incorporated

Meta Platforms Technologies, LLC

Vivek Sahu

Mehdi Saeidi

Jon James Anderson

Peng Wang

Rajat Mittal

Don Le

Shujuan Wang

Michael Nikkhoo

Chinchuan Andrew Chiu

Ryan Michael Coutts

Brian Toleno

Melika Roshandell

Alex Ockfen

Palkesh Jain

Taravat Khadivi

Ryan Coutts

A polyimide-based heat pipe is described. In examples, the heat pipe may include a first substrate including raised features on a surface of the substrate. In examples, the first substrate is covered with a second substrate or cover. At least the second substrate comprises polyimide. An outer surface of the heat pipe, e.g., the second substrate, includes one or more antennas disposed thereon.

Heat pipe including an integrated antenna

An optical device may include (i) a heat source that produces heat while operating, (ii) a thermally conductive optical element that is optically transparent and that dissipates the heat produced by the heat source, and (iii) a thermally conductive connector that transfers the heat between the heat source and the thermally conductive optical element. Various other methods, systems, and computer-readable media are also disclosed.

Apparatus, systems, and methods for heat transfer in optical devices

Because the touch temperature of a wearable computing device ('WCD') may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

System and method for thermal management of a wearable computing device based on proximity to a user

A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10&#x2dc;20 percent.

Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion

A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

Thermal arm for drone

Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

Enclosure cooling for thermal management of unmanned aerial vehicles

An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.

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San Diego, CA, United States of America

Vivek Sahu