Innovium, Inc.

Dell Products Inc.

Vittal Balasubramanian

Yongming Xiong

Keith Michael Ring

Per Henrik Fremrot

Joanne Cuijuan Zhang

In a circuit fabrication method, first, second, and third initial vias are fabricated in a circuit board. First and second conductive traces are fabricated at first and second depths in the circuit board. Either a first indication is obtained that, in a final circuit configuration, an integrated circuit is to be directly electrically connected to a first circuit element without directly electrically connecting to a second circuit element, or a second indication is obtained that, in the final circuit configuration, the integrated circuit is to be directly electrically connected to the second circuit element without directly electrically connecting to the first circuit element. In response to obtaining the first indication, a first portion of the second initial via is removed by drilling. In response to obtaining the second indication, a second portion of the second initial via is removed by drilling.

Circuit fabrication method that includes reconfiguration of via connections between circuit elements

Loss reduction methods are described. A first transmission loss associated with signal transmission through a trace in a first circuit board design is determined. The trace is routed from an integrated circuit disposed on a circuit board to a circuit element disposed on the circuit board. It is determined that the first transmission loss is greater than a threshold transmission loss. The first circuit board design is altered to obtain a second circuit board design. In the second circuit board design, the trace is routed from the integrated circuit to a connector disposed on the circuit board, and the connector is electrically coupled to the circuit element by a cable. A second transmission loss associated with signal transmission between the integrated circuit and the circuit element in the second circuit board design is less than the threshold transmission loss.

Reconfigurable circuit devices

A circuit system includes a circuit board. An integrated circuit is mounted on the circuit board, the integrated circuit including a plurality of pins. A trace-to-cable connector is mounted on the circuit board, the trace-to-cable connector configured to couple to a first cable of a first cable-type. A cable-to-cable connector is mounted on the circuit board, the cable-to-cable connector configured to couple the first cable to a second cable of a second cable-type. A first plurality of metal traces couple a first subset of the plurality of pins to the trace-to-cable connector.

Circuit board devices with reconfigurable connections

An apparatus that includes: a printed circuit board (PCB) that includes: a multilayer lamination of one or more ground layers, one or more power layers, and multiple signal layers; multiple vias that pass through one or more layers of the multilayer lamination, wherein a first via of the multiple vias includes: a first portion that has a first diameter, and a second portion that has a second diameter that is smaller than the first diameter, wherein a second via of the multiple vias includes: a third portion that has a third diameter, and a fourth portion that has a fourth diameter that is smaller from the third diameter; and wherein the first portion of the first via is adjacent to the fourth portion of the second via and the second portion of the first via is adjacent to the third portion of the second via is disclosed.

Printed circuit board including multi-diameter vias

A modular networking device connection system includes a modular networking system chassis that defines a modular networking device slot. An internal wall is located in immediately adjacent the modular networking device slot, and includes a internal wall connector that connects to a modular networking device positioned in the modular networking device slot. A networking processing device is located opposite the internal wall, and includes a networking processor that is mounted to a networking processing device board and coupled via at least one trace to a networking processing device connector that is mounted to the networking processing device board. The networking processing device connector is directly connected to the internal wall connector by a first cable that transmits signals received through the internal wall connector directly to the networking processing device connector for provision to the networking processor via the networking processing device board.

Growing community of inventors

San Jose, CA, United States of America

Vittal Balasubramanian