Rogers Germany Gmbh

Vitalij Gil

Andreas Meyer

Stefan Britting

László Müller

Rainer Herrmann

Johannes Wiesend

Nico Kuhn

Manfred Götz

Sebastian Polster

Olivier Mathieu

László MÜLLER

A carrier substrate () for electrical components, in particular metal-ceramic substrate () for electrical components, comprising

Metal ceramic substrate and method for manufacturing such metal ceramic substrate

A system for cooling a metal-ceramic substrate () having a component side () and a cooling side () opposite the component side (), comprising

System for cooling a metal-ceramic substrate, a metal-ceramic substrate and method for manufacturing the system

The present invention proposes a carrier substrate () for electrical components (), the carrier substrate () having a component side () and a cooling side () which is opposite the component side () and has a cooling structure (), the carrier substrate () comprising a primary layer () which faces the component side () and is produced from ceramic for electrical insulation, and a secondary layer () which faces the cooling side () for stiffening the carrier substrate (), characterized in that a metallic intermediate layer () is arranged between the primary layer () and the secondary layer () for heat transfer from the component side () to the cooling side (), the metallic intermediate layer () being thicker than the primary layer () and/or the secondary layer ().

Carrier substrate with a thick metal interlayer and a cooling structure

A cooling device () for cooling an electrical component (), in particular a laser diode, including

Cooling device for cooling an electrical component and method for producing a cooling device

Growing community of inventors

Hersbruck, Germany

Vitalij Gil