Applied Materials, Inc.

Crystal Solar, Inc.

Svagos Technik, Inc.

Elevated Materials US LLC

Visweswaren Sivaramakrishnan

Tirunelveli Subramaniam Ravi

Hichem M'Saad

Karthik Janakiraman

Andrzej Kaszuba

Ganesh Balasubramanian

Quoc Vinh Truong

Juan Carlos Rocha-Alvarez

Ludovic Godet

Thomas E Nowak

Jonathan Stuart Frankel

Mario David Silvetti

Deenesh Padhi

Martin Jay Seamons

Kedarnath Sangam

Chiu Chan

John M White

Joseph Yudovsky

Wei-Sheng Lei

Gary Fong

Subramanya P Herle

Derek R Witty

Dale Robert Du Bois

Ramprakash Sankarakrishnan

Sudha S Rathi

Mark A Fodor

David Masayuki Ishikawa

Stuardo A Robles

Mahendran Chidambaram

Bahubali S Upadhye

Li-Qun Xia

Rutger Meyer Timmerman Thijssen

Bok Hoen Kim

Pravin K Narwankar

Jianhua Zhou

Jun Zhao

Mohamad A Ayoub

Kaushal Gangakhedkar

Peter Wai-Man Lee

Quoc Truong

Colin Costano Neikirk

Eller Y Juco

Surinder S Bedi

Jean Rene Vatus

Nilesh Chimanrao Bagul

Pyongwon Yim

Srinivas D Nemani

Ellie Y Yieh

Steven Verhaverbeke

Joseph C Olson

Kelvin Chan

Amit Kumar Bansal

Alexandros T Demos

Tom K Cho

Amir Hamed Al-Bayati

Roman Gouk

Prerna Sonthalia Goradia

Daihua Zhang

Kurtis Leschkies

Kazuya Daito

Nagarajan Rajagopalan

Wayne McMillan

Inna Shmurun

Dustin Wenpin Ho

Tapash Chakraborty

Kang Luo

Bang C Nguyen

Naamah Argaman

Ankur Kadam

Nitin Deepak

Hemantha Raju

Chau H Nguyen

Hiroshi Nishizato

Mei Yin Chang

Vijay D Parkhe

Ananda H Kumar

Vincent W Ku

Kramadhati V Ravi

Tsutomu Tanaka

Hari K Ponnekanti

Vinay K Shah

Charles N Dornfest

Thanh Ngoc Pham

Satish Sundar

Talex Sajoto

Won B Bang

Dian Sugiarto

Yen-Kun Victor Wang

Kyle Tantiwong

Tzu-Fang Huang

Yuxiang May Wang

Dale R Dubois

Michael C Kwan

Sohyun Park

Kangkang Wang

Wendy H Yeh

Joseph C Werner

Lihua Li

Hyoung-Chan Ha

Andrzei Kaszuba

Embodiments of the present disclosure generally relate to flexible substrate fabrication. In particular, embodiments described herein relate to an apparatus and methods for flexible substrate fabrication using nip rollers to improve tension uniformity. In one embodiment, a roller assembly includes a primary roller for transporting a flexible substrate, wherein the primary roller has a first end and a second end, wherein the flexible substrate has a coating disposed hereon, and wherein one or more edge regions are not covered by the coating. The roller assembly further includes a first nip roller disposed at the first end of the primary roller that contacts a first edge region of the one or more edge regions, and a second nip roller disposed at the second end of the primary roller that contacts a second edge region of the one or more edge regions.

Inclusion of special roller to avoid creasing, wrinkling and distortion of flexible substrate in roll to roll process

A method and apparatus for thermal evaporation are provided. The thermal evaporator includes a flat crucible design, which provides an increased surface area for evaporation of the material to be deposited relative to conventional designs. The increased surface area for evaporation means that the more vapor of the evaporated material can be produced, which increases pressure inside the evaporator body leading to increased flow of the evaporated material out of the nozzles. The flat crucible can be attached to an evaporator body of the thermal evaporator. The flat crucible can be integrated within the evaporator body. The evaporator body can include a plurality of longitudinal grooves, which increase the surface area of the evaporator body. The thermal evaporator can include a plurality of baffles which divide the thermal evaporator into separate compartments.

Evaporator for effective surface area evaporation

A reactor for coating particles includes one or more motors, a rotary vacuum chamber configured to hold particles to be coated, wherein the rotary vacuum chamber is coupled to the motors, a controller configured to cause the motors to rotate the rotary vacuum chamber about an axial axis of the rotary vacuum chamber such that the particles undergo tumbling agitation, a vacuum port to exhaust gas from the rotary vacuum chamber, a paddle assembly including a rotatable drive shaft extending through the rotary vacuum chamber and coupled to the motors and at least one paddle extending radially from the drive shaft, such that rotation of the drive shaft by the motors orbits the paddle about the drive shaft in a second direction, and a chemical delivery system including a gas outlet on the paddle configured inject process gas into the particles.

Rotary reactor for uniform particle coating with thin films

In an embodiment, a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer is provided. The method includes detecting the mask layer by a sensor, the mask layer providing a substrate surface; determining a property of the blind via, the property comprising one or more of a top diameter, a bottom diameter, a volume, or a taper angle; focusing a Gaussian laser beam, under laser process parameters, at the substrate surface to remove at least a portion of the mask layer; adjusting the laser process parameters based on the property; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. The mask layer can be pre-etched. Apparatus for forming a blind via in a substrate are also provided.

Method and apparatus for laser drilling blind vias

A vapor deposition system and methods of operation thereof are disclosed. The vapor deposition system includes a vacuum chamber; a dielectric target within the vacuum chamber, the dielectric target having a front surface and a thickness; a substrate support within the vacuum chamber, the substrate support having a front surface spaced from the front surface of the dielectric target to form a process gap; and a signal generator connected to the dielectric target to generate a plasma in the vacuum chamber, the signal generator comprises a power source, the power source configured to prevent charge accumulation in the dielectric target. The method includes applying power to a dielectric target within a vacuum chamber to generate a plasma in a process gap between the dielectric target and a substrate support and pulsing the power applied to the dielectric target to prevent charge accumulation.

Pulsed DC power for deposition of film

A physical vapor deposition system includes a deposition chamber, a support to hold a substrate in the deposition chamber, a target in the chamber, a power supply configured to apply power to the target to generate a plasma in the chamber to sputter material from the target onto the substrate to form a piezoelectric layer on the substrate, and a controller configured to cause the power supply to alternate between deposition phases in which the power supply applies power to the target and cooling phases in which power supply does not apply power to the target. Each deposition phase lasts at least 30 seconds and each cooling phase lasts at least 30 seconds.

Physical vapor deposition of piezoelectric films

Exemplary methods of removing lithium-containing deposits may include heating a surface of a lithium-containing deposit. The surface may include oxygen or nitrogen, and the lithium-containing deposit may be disposed on a surface of a processing chamber. The methods may include contacting the surface of the lithium-containing deposit with a hydrogen-containing precursor. The contacting may hydrogenate the surface of the lithium-containing deposit. The methods may include contacting the lithium-containing deposit with a nitrogen-containing precursor to form volatile byproducts. The methods may include exhausting the volatile byproducts of the lithium-containing deposit from the processing chamber.

Cleaning materials and processes for lithium processing equipment

A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

Laser dicing glass wafers using advanced laser sources

Apparatus and systems for temperature probe integration on pedestal heaters of a processing chamber including a cooling assembly for cooling temperature probes disposed within. Cooling assemblies can be actively water-cooled, passively cooled by fin stacks. Further cooling assemblies include a mechanical arm assembly for lowering or raising the temperature probes.

Apparatus for fiber optic temperature probe in processing chambers

Methods for etching alkali metal compounds are disclosed. Some embodiments of the disclosure expose an alkali metal compound to an alcohol to form a volatile metal alkoxide. Some embodiments of the disclosure expose an alkali metal compound to a β-diketone to form a volatile alkali metal β-diketonate compound. Some embodiments of the disclosure are performed in-situ after a deposition process. Some embodiments of the disclosure provide methods which selectively etch alkali metal compounds.

Etching of alkali metal compounds

Embodiments described herein relate to an inkjet printing platform. The inkjet printing platform is utilized for fabrication of optical films and optical device structures. The inkjet printing platform includes a transfer chamber, one or more inkjet chambers, a plurality of auxiliary modules, a substrate flipper, and load ports. The inkjet printing platform is operable to perform an inkjet printing process on a substrate to form an optical film and/or an optical device.

Inkjet platform for fabrication of optical films and structures

Embodiments described herein relate to an inkjet service station and methods of servicing an inkjet printer with the inkjet service station. The inkjet service station is disposed in an inkjet printer of an inkjet chamber. The inkjet service station is operable to perform servicing operations on a processing apparatus of the inkjet printer. The servicing operations include at least one of printhead spitting, printhead purging, printhead flushing, printhead cleaning, printhead drying, or vacuum suction.

Multifunctional printhead service station with multi-axis motions

Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.

Handling and processing double-sided devices on fragile substrates

An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform, at least one light source configured to generate a first light beam and a second light beam, a polygon mirror scanner, an actuator, and a galvo mirror scanner. The polygon mirror scanner is configured to receive the first light beam and reflect the first light beam towards the platform. Rotation of the first polygon mirror causes the light beam to move in a first direction along a path on a layer of feed material on the platform. The actuator is configured to cause the path to move along a second direction at a non-zero angle relative to the first direction. The galvo mirror scanner system is configured to receive the second light beam and reflect the second light beam toward the platform.

Additive manufacturing with a polygon scanner

A method of fabricating a piezoelectric layer includes depositing a piezoelectric material onto a substrate in a first crystallographic phase by physical vapor deposition while the substrate remains at a temperature below 400&#xb0; C., and thermally annealing the substrate at a temperature above 500&#xb0; C. to convert the piezoelectric material to a second crystallographic phase. The physical vapor deposition includes sputtering from a target in a plasma deposition chamber.

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Cupertino, CA, United States of America

Visweswaren Sivaramakrishnan