Lsi Logic Corporation

Virinder Singh

Mike T Liang

A method for laying out input/output (I/O) pairs, each including an I/O cell and a pad, on an integrated circuit die. Size information is obtained for each of a first I/O pair and a second I/O pair. A minimum pad spacing criterion is obtained which specifies a minimum distance between the pad in the first I/O pair and an element of the second I/O pair, and the first I/O pair and the second I/O pair are laid out so as to satisfy the minimum pad spacing criterion. Also provided is a method for laying out pads for input/output (I/O) cells on an integrated circuit die in which size information is obtained for each of a first I/O cell pad and a second I/O cell pad. A minimum pad spacing criterion is obtained, and the first I/O cell pad and the second I/O cell pad are laid out so as to satisfy the minimum pad spacing criterion.

I/O device layout during integrated circuit design

Integrated circuit chip (IC) design and fabrication is a complex process requiring many stages including elaborate cell placement processes. The present invention provides a method and apparatus to facilitate the placement of cells on the surface of an integrated circuit device. Specifically, the invention involves placement of one type of cells (such as logic cells, I/O cells or scan cells) apart from other types of cells. The present invention facilitates the placement of such cells by first parsing the netlist to remove all cells other than the specific type of cells that are to be placed.

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Fremont, CA, United States of America

Virinder Singh