Texas Instruments Corporation

Tt Electronics Plc

Virgil Cotoco Ararao

John Charles Ehmke

Brent Hans Larson

Lance W Barron

Toby R Linder

In described examples, a first device on a first surface of a substrate is coupled to a structure arranged on a second surface of the substrate. In at least one example, a first conductor arranged on the first surface is coupled to circuitry of the first device. An elevated portion of the first conductor is supported by disposing an encapsulate and curing the encapsulate. The first conductor is severed by cutting the encapsulate and the first conductor. A second conductor is coupled to the first conductor. The second conductor is coupled to the structure arranged on the second surface of the substrate.

Through-substrate conductor support

An optical detector device including: a glass substrate having conductive traces plated thereon; a semiconductor device having an optical detector exposed on a side facing the glass substrate, the semiconductor device further including a plurality of bond pads electrically coupled to a first subset of the conductive traces; a metallic seal structure bonding a side of the glass substrate having the conductive traces with the side of the semiconductor device facing the glass substrate; and a plurality of conductive structures outside of a perimeter of the semiconductor device, the plurality of conductive structures being electrically coupled to a second subset of the conductive traces.

Semiconductor device package and method for use thereof

In described examples, a hermetic package of a microelectromechanical system (MEMS) structure includes a substrate having a surface with a MEMS structure of a first height. The substrate is hermetically sealed to a cap forming a cavity over the MEMS structure. The cap is attached to the substrate surface by a vertical stack of metal layers adhering to the substrate surface and to the cap. The stack has a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance. The stack has: a first bottom metal seed film adhering to the substrate and a second bottom metal seed film adhering to the first bottom metal seed film; and a first top metal seed film adhering to the cap and a second top metal seed film adhering to the first top metal seed film.

Hermetically sealed MEMS device and its fabrication

A hermetic package comprising a substrate () having a surface with a MEMS structure () of a first height (), the substrate hermetically sealed to a cap () forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack () of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (); the stack having a bottom first metal seed film () adhering to the substrate and a bottom second metal seed film () adhering to the bottom first seed film, both seed films of a first width () and a common sidewall (); further a top first metal seed film () adhering to the cap and a top second metal seed film () adhering to the top first seed film, both seed films with a second width () smaller than the first width and a common sidewall (); the bottom and top metal seed films tied to a metal layer () including gold-indium intermetallic compounds, layer () having a second height () greater than the first height and encasing the seed films and common sidewalls.

Hermetically-sealed MEMS device and its fabrication

A hermetically packaged microelectromechanical system (MEMS) device has a substrate with an assembly pad () and a plurality of terminals (); a chip () with a MEMS mechanical element () of a first height () assembled on the pad and connected to the terminals by wires () with an insulating coat (); a ridge () on the substrate, which surrounds the MEMS element () with a second height () greater than the first height and comprises a plastic compound () filled with particles () and a surface () having an adhering moisture-impermeable seal layer (); and a moisture-impervious lid () attached to the ridge by moisture-proof bonds (), sealing the volume () enclosed by the lid, the chip, and the metalized ridge as a hermetic space for the MEMS element ().

Hermetic plastic molded MEMS device package and method of fabrication

A hermetic package comprising a substrate () having a surface with a MEMS structure () of a first height (), the substrate hermetically sealed to a cap () forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack () of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (); the stack having a bottom metal seed film () adhering to the substrate with a first width (), and further a top metal seed film () adhering to the cap with a second width () smaller than the first width, the top metal seed film tied to a layer () including gold-indium intermetallic compounds, layer () having a height greater than the first height.

A microelectromechanical (MEMS) device is fabricated from a wafer having a plurality of die regions with grooves and MEMS components formed on a wafer surface at each die region. A first metal having a relatively high melting temperature is formed on sidewalls of each groove, and a cap is attached at each die region to provide a closed cavity which encloses the grooves and MEMS components. Bottoms of the grooves are opened by thinning the wafer thereby establishing through-hole vias extending through the wafer at each die region, for accessing the cavity for inserting or removing material. The vias are sealed by interacting a second metal having a relatively low melting temperature with the first metal layer to form intermetallic compounds with higher melting temperature that maintain the seal during subsequent lower temperature operations.

Growing community of inventors

McKinney, TX, United States of America

Virgil Cotoco Ararao