Allegro Microsystems, LLC

Virgil Ararao

Nirmal Sharma

William P Taylor

Jay J Gagnon

John B Sauber

Raymond W Engel

Elsa Kam-Lum

Kirsten Doogue

Leonardo T Magpantay

Raymond W Engle

Methods and apparatus for a magnetic field sensor in a molded IC package having a magnetic field sensing element in a die with a component coupled to a leadframe at a downset area. In embodiments, a thickness of the leadframe in the downset area is less than a thickness of the leadframe in a non-downset area adjacent to the downset area.

Sensor and method of providing a sensor

Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.

Methods and apparatus for flip-chip-on-lead semiconductor package

Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.

Magnetic field sensors and methods for fabricating the magnetic field sensors

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

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Rutland, MA, United States of America

Virgil Ararao