International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Lenovo Global Technology (united States) Inc.

Vinod Kamath

Mark Edward Steinke

Madhusudan K Iyengar

Roger R Schmidt

David P Graybill

Bejoy J Kochuparambil

Timothy Joseph Chainer

Jason Aaron Matteson

Jeffrey Scott Holland

Tin-Lup Wong

Mohanlal Savji Mansuria

Lawrence Shungwei Mok

Michael Sven Miller

Beth Frayne Loebach

Leo Harold Webster, Jr

Richard C Chu

Jimmy Grant Foster, Sr

Paul Theodore Artman

Albert Vincent Makley

Joseph Anthony Holung

Michael Sean June

Howard V Mahaney, Jr

Derek Ian Schmidt

James Scott Womble

Chunjian Ni

Michael J Ellsworth, Jr

Gary David Cudak

Robert E Simons

Levi A Campbell

Michael A Gaynes

Mark Delorman Schultz

Eric Alan Eckberg

Thomas Mario Cipolla

Michael Raymond Miller

Thomas M Brey

Karl Klaus Dittus

Richard M Barina

Patrick Anthony Coico

Michael A Boraas

Jamil A Wakil

Aparna Vallury

Mark Evan Cohen

Troy Williams Glover

Andrew Thomas Junkins

Whitcomb Randloph Scott, Iii

Joseph Anthony Ho-Lung

Daniel P Simco

Milnes P David

Eren Kursun

Dean Frederick Herring

Sri Muthuthamby Sri-Jayantha

Pritish Ranjan Parida

Fred Allison Bower, Iii

Aaron Roger Cox

Ajay Dholakia

Paul Andrew Wormsbecher

Brian Michael Kerrigan

Hien Phu Dang

Vijayeshwar Das Khanna

Gregory Brian Pruett

Gerard McVicker

Fusanobu Nakamura

Martin Joseph Crippen

Patrick M Bland

Timothy Andreas Meserth

Stephen Peter Mroz

David Frederick Champion

Christopher Landon Wood

Howard Victor Mahaney, Jr

Jason E Minyard

Gregory Joseph McKnight

Hoi Yeung Chan

Ralph M Begun

Keith Manders Campbell

Trieu Can Chieu

Raymond Mathew Clemo

David John Jensen

Glenn Edward Myrto

William M Megarity, Jr

Sumanta Kumar Bahali

Jung H Yoon

Pat Gallarelli

Ivan R Zapata

William J Grady

Thomas Richard Hildner

Alvin G Davis

Alan Claassen

Fumitoshi Kiyooka

Warren E Price

Whitcomb Randolph Scott, Iii

Jean Jidong Xu

Brian A Canney

Dennis John Hansen

Billy W Medlin

Leo H Webster

Brian Gormley

Jim Drake

Arvind Modekurti

Miroslav Hodak

Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component are disclosed. According to an aspect, a cooling system includes a conduit configured to be in conductive heat transfer interface with an electronic component. The conduit is configured to transfer a first portion of heat from the electronic component to a flow of a cooling liquid. The heat transfer device is also configured to be in conductive heat transfer interface with the electronic component, and to transfer a second portion of heat from the electronic component. The cooling system includes a heat collector manifold configured to receive the flow of the cooling liquid with the first portion of heat from the conduit, to receive the second portion of heat via conductive heat transfer from the heat transfer device, and to transfer the second portion of heat to the flow of the cooling liquid.

Cooling systems having a conduit and a heat transfer device for transferring heat from an electronic component

Cooling systems having cooling and augmentation loops for electronic components and related methods are disclosed. According to an aspect, a cooling system for an electronic component includes a cooling loop in thermal transfer interface with a first electronic component. The cooling loop is configured to contain a first flow of a cooling liquid between an inlet and an outlet. The cooling system also includes at least one augmentation loop configured to contain a second flow of the cooling liquid and alternately engage and disengage with respect to the cooling loop, such that engaging the augmentation loop to the cooling loop converts a series flow pattern with the first flow of the cooling liquid into a parallel flow pattern of a portion of the first flow of the cooling liquid with the second flow of the cooling liquid, without disconnection of the cooling loop from the inlet and outlet.

Cooling systems having cooling and augmentation loops for electronic components and related methods

An edge device, method and computer program product may perform, include or cause performance of various operations. The operations include determining an amount of electrical energy that an edge device is expected to have available from a local renewable energy system during each of a plurality of time periods and determining an amount of electrical energy that the edge device is expected to use for operations during each of the plurality of time periods. The operations further include identifying a first one of the time periods for which the determined amount of electrical energy that the edge device is expected to have available from the local renewable energy system is greater than the determined amount of electrical energy that the edge device is expected to use for operations and causing a cooling system that cools the edge device to perform an overcooling operation during the identified first time period.

Overcooling an edge device that uses electrical energy from a local renewable energy system

A computer-implemented method includes identifying a plurality of adapter modules of a particular adapter module type that are installed in a plurality of slots of a single host computer, and identifying, for each of the identified adapter modules, a slot of the plurality of slots in which the adapter module is installed. The method may further includes accessing, for each identified slot, a predetermined relative thermal efficiency value for operation of an adapter module of the particular adapter module type in a particular slot, and controlling, for one or more of the identified adapter modules, the operation of the identified adapter module based on the predetermined relative thermal efficiency value for the slot in which the identified adapter module is installed. A computer program product may also include program instructions that are executable by a processor to cause the processor to perform the method.

Relative thermal efficiency values for controlling operation of adapter modules

Method, system, and computer program product embodiments of heating a flow of liquid by transfer of heat with computing devices. Embodiments also include determining a dynamic cooling capacity index for each of the computing devices, and allocating processing workload among the first computing device and the second computing device based on the dynamic cooling capacity indexes of the computing devices. Embodiments further include allocating workload and/or regulating flow rate of the flow of liquid to maintain a predetermined value or range of values of temperature of the liquid.

Optimizing waste heat recovery and return water temperature using dynamic flow control based on server power profiles and cooling capacity of servers

An apparatus for a hybrid single-phase/two-phase cooling loop to enhance cooling of components in a computing device is disclosed. The apparatus includes a single-phase cooling loop routed through a first part of a component. The component includes semiconductor devices. The single-phase cooling loop includes a fluid configured to remain in a liquid state after removing heat from the first part of the component. The apparatus includes a two-phase cooling loop routed through a second part of a component. The two-phase cooling loop includes a dielectric fluid configured to at least partially transition from a liquid state to a gas state at a selected temperature of a semiconductor device of the second part of the component while removing heat from the second part of the component.

Hybrid single-phase/two-phase cooling loop to enhance cooling of components

Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.

Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof

Systems and methods for controlling air distribution to electronic components are disclosed. According to an aspect, a system includes fans configured to distribute air to a plurality of electronic components. The system also includes a fan controller configured to control the fans based on a form factor and/or a quantity of the electronic components.

Systems and methods for controlling air distribution to electronic components

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same are disclosed herein. According to an aspect, a system includes a fluid conduit comprising a first portion and a second portion that are fluidly connected to each other for carrying cooling fluid proximate to a first electronic component and a second electronic component of a computing device. The system also includes a first fluid conduit carrier configured to hold the first portion of the conduit. Further, the system includes a second fluid conduit carrier configured to hold the second portion of the conduit. The first fluid conduit carrier and the second fluid conduit carrier are configured to connect to one another.

Systems having fluid conduit carriers for holding different portions of a fluid conduit and methods of using the same

A fluid-cooled computer system includes a plurality of heat-generating components and a cooling system configured for supplying a cooling fluid at a controlled cooling fluid flow rate to cool the heat-generating components. A temperature-based cooling control circuit includes a temperature sensor configured for sensing a temperature of the heat-generating components and control logic for increasing a cooling fluid flow rate in response to the temperature exceeding a temperature threshold. A power-based cooling control circuit is configured for identifying and quantifying an increasing power consumption trend over a target time interval and, during a period that the temperature of the electronic device does not exceed the temperature threshold, increasing a cooling fluid flow rate to the electronic device in response to the magnitude of the increasing power consumption trend exceeding a power threshold. In one option, the fluid-cooled computer system is a server and the heat-generating components include a processor.

Fluid-cooled computer system with proactive cooling control using power consumption trend analysis

A liquid-cooling mechanism, or sub-system, has a thermally conductive plate in which a cooling liquid channel is disposed, and a thermally conductive pad disposed on the thermally conductive plate. An electronic device is mounted to the thermally conductive pad, such as via a mounting component, in a manner that decreases translational movement of a contact surface of the electronic device against a contact surface of the thermally conductive pad. When mounted to the thermally conductive pad, the electronic device compresses the thermally conductive pad.

Mounting electronic device to thermally conductive pad of liquid-cooling mechanism in translational movement-minimizing manner

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

Overmolded dual in-line memory module cooling structure

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Growing community of inventors

Raleigh, NC, United States of America

Vinod Kamath