Texas Instruments Corporation

Texas Instruments India Limited

Vinod J Menezes

Mahesh Madhukar Mehendale

Vipul Kumar Singhal

Rajat Chauhan

Michael Patrick Clinton

Lakshmikantha V Holla

Theodore Warren Houston

Pulkit Shah

Rubin Ajit Parekhji

Premkumar Seetharaman

Rajdeep Mukhopadhyay

Vish Visvanathan

Sharad Kumar Gupta

Per Torstein Roine

Dharin Nayeshbhai Shah

Kaichien Tsai

Kishalay Datta

Manikandan Rr

Vamsi Gullapalli

Hugh Thomas Mair

Bryan David Sheffield

Robert L Pitts

Shahid Ali

Muthusubramanian Venkateswaran

Divya Kaur

Gilles Dubost

Aman A Kokrady

Jayateerth Pandurang Mathad

Rajith Kumar Mavila

Raghava Madhu

Sundeep Lakshmana Javvaji

Christophe Pierre Vatinel

James Sangwon Song

Roger Griesmer

Subramani Kengeri

Rr Manikandan

William Douglas Wilson

Mark J Jensen

Philippe Royannez

Kun-His Li

Roger C Griesmer

In described examples, a circuit includes a switch. The switch includes first transistors and second transistors. A voltage generation circuit is coupled to the switch. A level shifter is coupled to the voltage generation circuit and is configured to receive a control signal. A logic unit is coupled to the level shifter and the voltage generation circuit. The logic unit is configured to generate a secondary signal. The first transistors are configured to receive the control signal, and the second transistors are configured to receive the secondary signal.

Fail-safe switch for multidomain systems

A USB Type-C/Power Delivery controller chip includes a first pin for receiving a first voltage, a second pin for receiving a second voltage, and a third pin for coupling to the CC pin of a USB connector. The USB controller chip includes a VCONN power supply circuit having a blocking field effect transistor (BFET) coupled in series with a hot-swap field FET (HSFET) between the first and third pins, and first and second Zener diodes coupled anode-to-anode between the HSFET's source and gate. A cable detection circuit includes a BFET coupled between the second and third pins, and a Zener diode coupled between the BFET's gate and a lower rail. A power delivery physical layer circuit includes a receiver and a transmitter, each coupled to the third pin through a respective BFET, the respective BFETs each having a Zener diode coupled between respective gates and the lower rail.

USB type-C/PD controller having integrated VBUS to CC short protection

In a method of testing a semiconductor wafer, a probe tip contacts a pad in a scribe line space between facing sides of first and second dies. The probe tip is electrically coupled to an automated test equipment (ATE). The second die is spaced apart from the first die. The scribe line space includes an interconnect extending along at least an entire length of the facing sides of the first and second dies. The pad is electrically coupled through the interconnect to at least one of the first or second dies. With the ATE, circuitry is tested in at least one of the first or second dies. The pad is electrically coupled through the interconnect to the circuitry.

Methods of testing multiple dies

In some examples, a voltage regulator includes a first pair of switches controllable by a first clock signal having a first phase. The switches in the first pair are coupled to each other via a capacitor. The voltage regulator also includes a second pair of switches controllable by a second clock signal having a second phase. The first and second phases are non-overlapping. The switches in the second pair are coupled to each other via the capacitor.

Multi-switch voltage regulator

In an example, an apparatus includes a level-shifting circuit and a ramp detector. The level-shifting circuit has a current choke and a transistor coupled across the current choke, the level-shifting circuit adapted to be coupled to a first voltage source. The ramp detector has a ramp detector input adapted to be coupled to the first voltage source and a ramp detector output coupled to the transistor, the ramp detector adapted to be coupled to a second voltage source.

Level shifter

An electronic device having multiple power output circuits that individually include a switch control input, a bypass control input, an output transistor and an output control circuit that includes an RC circuit with a resistor and a capacitor coupled to the output transistor gate and a bypass switch in parallel with the RC circuit resistor. The electronic device includes a controller that selects one of the power output circuits for a given power transfer cycle, closes the bypass switch to bypass the resistor of the selected power output circuit and turns the output transistor of the selected power output circuit on to transfer current from the inductor to a load of the selected power output circuit.

Single inductor multiple output regulator

A switch-mode power supply includes a DC-DC converter and metering circuitry that is coupled to the DC-DC converter. The metering circuitry includes scaling circuitry, a current source, a capacitor, switching circuitry, and a comparator. The scaling circuitry is configured to generate a reference current scaled to be a predetermined fraction of a peak current flowing in an inductor of the DC-DC converter. The current source is configured to output a first current that is one-half of the reference current. The capacitor is coupled to the current source. The switching circuitry is configured to switchably connect the current source to the capacitor. The comparator is coupled to the capacitor. The comparator is configured to generate a signal indicating that a voltage across the capacitor exceeds a threshold voltage.

Load current measurement

In a method of testing a semiconductor wafer including a scribe line and multiple dies, the method includes implementing a first landing pad on the scribe line, and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip, and applying an ATE resource to the first cluster of dies.

Systems and methods of testing multiple dies

In described examples, a sawtooth waveform generator generates a sawtooth waveform having a first rise time. A comb waveform circuit has a power terminal coupled to receive the sawtooth waveform from an output of the sawtooth waveform generator. The comb waveform circuit generates a comb waveform in response to the sawtooth waveform. The comb waveform has a second rise time that is faster than the first rise time.

Low frequency oscillator with ultra-low short circuit current

A method of testing a semiconductor wafer comprising a scribe line and a plurality of dies. The method includes implementing a first landing pad on the scribe line and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the plurality of dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip and applying an ATE resource to the first cluster of dies.

A low power reset circuit includes a bias generator for receiving an operating voltage generated by a power supply and generating a bias voltage in response to the received operating voltage. The operation speed of a shaper for generating a shaped signal for indicating the operating voltage and the operation speed of a comparator for comparing a threshold reference voltage with the shaped signal are both controlled in response to the generated bias voltage. The comparator also generates a comparison signal for indicating a result of the comparison. In response to the comparison signal, a reset signal generator generates a reset signal for resetting protected circuitry powered by the operating voltage generated by the power supply.

Low power reset circuit

Growing community of inventors

Bengaluru, India

Vinod J Menezes