Other

Malema Engineering Corporation

Vertical Test Inc.

Vinh T Nguyen

Claus Waldersdorff Knudsen

Jayasekar Rajagopalan

Deepak Bhagwan Malani

Peter Anthony McCann

Claude A S Hamrick

A flow sensor includes a flow tube in a form of a tube and a support cast around the flow tube. The support clamps the flow tube and the flow tube extends through the support. The flow sensor is formed by placing the flow tube in a tube cavity of a casting mold and pouring or injecting a liquid resin into a support cavity of the casting mold. The support is formed around the flow tube from solidifying the liquid resin in the support cavity of the casting mold. A temperature of the casting mold during formation of the support does not exceed a threshold temperature to avoid deformation of the flow tube. The flow sensor can also include at least one memory chip that stores calibration information associated with the flow sensor and connectors that allows a controller to read the calibration information from the memory chip.

Polymer-based Coriolis mass flow sensor fabricated through casting

A flow measurement system includes two or more flow sensors that may operate simultaneously and a plurality of connected flow paths for flow of fluids. Each flow sensor is positioned along a different flow path of the plurality of connected flow paths and includes at least one flow tube and a support that clamps the flow tube. The flow tube of each flow sensor has a different resonant frequency so that cross-talk between the flow sensors can be reduced or eliminated. In some embodiments, the flow tube of each flow sensor has a different tube length, wall thickness, material, and/or weight. The flow measurement system can also include one or more pumps for pumping fluid into the flow sensors and a dampener arranged between a pump and a corresponding flow sensor for mitigating interference on the flow sensor from operation of the pump.

Coriolis mass flow sensors having different resonant frequencies

An electric compound aircraft is disclosed with a capability of making vertical takeoff and landing and forward flight. In a specific embodiment, the compound aircraft includes an electric motor-powered tip-jet-driven rotary wing, an electric motor-powered tip-jet-driven propeller. The rotary wing provides lift for vertical takeoff and landing, hovering capability and during flight. The propeller provides thrust for forward flight. A fixed wing can be used, in addition to the rotary wing to provide lift for forward flight. Various electric control devices are used to provide control and stability for the compound aircraft and automation.

Electric motor-driven compound aircraft

A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.

Multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces

A process for making a multi-layered circuit board having electrical current traces includes providing a substrate having a 1layer of conductive material to form a ground plane, plurality of metallic 1traces on a 2side of the substrate having widths of approximately 25 microns or less, developing 1ribs of photoresist forming 1walls rising above upper surface of an adjacent seed layer trace, depositing 1conductive signal traces having a thickness exceeding 25 microns into channels and over seed layer traces and stripping the ribs to leave 1conductive traces having a height-to-transverse ratio exceeding 1.

Process for making a multilayer circuit board

A wafer probe head assembly for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs formed on a wafer to be tested includes an adapter board and a probe card assembly including a space transformer and a contactor carrying substrate having a substantially planar bottom surface with printed or plated circuit traces formed thereon and a plurality of contactors plated to or photo-lithographically formed on the traces and arranged to simultaneously ohmically engage the contact pads of one or more ICs on a wafer under test. The contactors may include resilient supporting structures attached to or integrated with the signal carrying circuit traces. The probe card assembly may also include one or more substrate layers with the circuit traces and vias formed on and/or within the substrate layers to facilitate connection of the tester to the contactors.

Probe head assembly for use in testing multiple wafer die

An improved contact probe pin for wafer probing apparatus including an elongated metal conductor having a connector (or proximal) end, a center or medial section coated with an elastic material, and a contact pad engaging tip end. At least a portion of the center section of the probe pin is coated with a poorly conductive, but highly elastic material so as to enhance its flex characteristics. The coating may uniformly cover a portion of the center section of the probe pin or it may take on a predetermined pattern or shape. The coating may also unevenly cover a portion of the center section of the probe pin. The coating is selected such that it augments or enhances the resiliency of the pin and causes it to have a predetermined stress-strain profile with vertical (or Z-axis) displacement, and thus enables it to have predetermined probe pin tip contact force characteristics.

Growing community of inventors

San Jose, CA, United States of America

Vinh T Nguyen