Neah Power Systems, Inc.

Vinh Chung

Jonathan Chan Mallari

Slobodan Petrovic

Suzanne M Snyder

The disclosed invention relates to masked silicon structures and methods for making porous silicon in selected areas of a silicon substrate via anodic etching. The masked silicon structures comprise: (1) a frontside barrier layer; and (2) a backside opaque ohmic contact layer. The frontside barrier layer includes a plurality of discrete barrier openings bounded by a contiguous frontside portion of the barrier layer, thereby defining a first aperture having a first shape and a first center point. The backside opaque ohmic contact layer includes a second aperture bounded by a contiguous backside portion of the ohmic contact layer, thereby defining a second aperture having a second shape and a second center point. The first and second center points share a perpendicular axis. The first shape is substantially the same as the second shape but slightly larger, and is trans-concentrically positioned relative to the second shape about the shared axis.

Porous silicon undercut etching deterrent masks and related methods

Disclosed herein are fuel cell systems and, more specifically, fuel cell electrode pair and stack assemblies and various methods relating thereto. In one embodiment, the present invention is directed to a fuel cell electrode pair assembly adapted for use with a fuel cell system, wherein the electrode pair assembly comprises an anode structure derived from a first silicon substrate and an opposing cathode structure derived from a second silicon substrate, wherein at least (i) the anode structure comprises one or more discrete anodic porous active regions disposed across a top surface, or (ii) the cathode structure comprises one or more discrete cathodic porous active regions disposed across a top surface, and wherein the anode structure and the cathode structure each have at least one adjoining support member made of silicon, one or more plastics, or one or more glasses, and wherein the at least one adjoining support member of the anode structure and the at least one adjoining support member of the cathode structure have interfacing surfaces that are bonded together with an optional interposing binding material and with at least one selectively positioned bond to thereby form a hermetic seal, wherein the at least one selectively positioned bond is selected from the group consisting of a silicon-metal eutectic-silicon bond, a silicon-frit-silicon bond, a silicon-metal-silicon microwave bond, a silicon-polymer adhesive-silicon bond, a silicon-polymer adhesive-plastic bond, a silicon-polymer adhesive-glass bond, or a silicon-glass anodic bond.

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Bellevue, WA, United States of America

Vinh Chung