E.i. Dupont De Nemours and Company

Dupont Electronics, Inc.

Vincenzo Arancio

Jay Robert Dorfman

Hee Hyun Lee

David Andrew Greenhill

This invention provides a polymer thick film dielectric paste composition, comprising a mixture of titanium dioxide and boron nitride powders, a resin blend of polyol and phenoxy resin, one or more additives selected from the group consisting of a linear aliphatic polyester, a block copolymer, a blocked aliphatic polyisocyanate, and a wetting and dispersing agent, and one or more polar, aprotic solvents. The paste composition may be used to form polymer thick film dielectric layers in electrical circuits subject to thermoforming and in articles requiring stretchable dielectric layers such as wearables.

Polymer thick film dielectric paste composition

A printable ink for electronic applications is disclosed. The ink contains at least one non-interactive solvent, a binder, optionally one or more particulate fillers that may be conductive, semi-conductive or non-conductive, optionally a co-solvent and optionally other additives.

Printable compositions useful in electronic applications and methods relating thereto

This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.

Thermally conductive dielectric for thermoformable circuits

This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.

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Bristol, United Kingdom

Vincenzo Arancio