Sae Magnetics (h.k.) Limited

Cloud Light Technology Limited

Vincent Wai Hung

Vivian Wei Ma

Dennis Tak Kit Tong

Margarito P Banal, Jr

Francis Guillen Gamboa

Wing Keung Mark Mak

Xiaoming Yu

Yuk Nga Chen

Gad Joseph Hubahib Gaviola

Fuk Ming Lam

Victor Pak Hong Ng

Amanda Tin Hoi Siu

Yvonne Xiaoming Yu

Kwok Leung Wong

Wei Ma

Chi Yan Wong

Hau Chen Loke

Kwong Shing Tsang

Ka Lap Tong

Jason Hok Hay Tang

Chih Hsun Lin

Hulmut Ying Wai Sun

Hermit Ka Kit Wong

Paladin Li Peng Cai

Yat Hin Chan

Danny Chih Hsun Lin

Structures and active alignment methods thereof of a Transmitter Optical Sub-Assembly (TOSA) Structure are provided, that includes a light source sub-assembly including a light source component assembled on a light source bench; an optical sub-assembly including an optical component assembled on an optical bench; and a silicon chip including a coupler. A light emitted by the light source component is received by the coupler via the optical component along an optical path, the light source bench and the optical bench are thermally conductive to dissipate heat. The light source sub-assembly and the optical sub-assembly are actively aligned at the same time to optimize optical coupling between the light source sub-assembly and the optical sub-assembly by optimizing positions and a distance of the light source sub-assembly and the optical sub-assembly, the positions and the distance are flexibly adjusted during the active alignment process.

Transmitter optical sub-assembly structure and active alignment method thereof

An optical transceiver sub-assembly () integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber () and a top cover () to enclose elements of the optical transceiver sub-assembly () other than the housing chamber () and the top cover (), a bottom housing module () accommodating an optical micro integration (). In particular, the optical transceiver sub-assembly () is operably configured to establish an optical-electrical communication with an outside surrounding.

Compact micro bench for optical transceiver sub-assembly

An optical subassembly for non-reciprocal coupling of light from a planar optical waveguide output outside the optical subassembly to an optical fiber includes a carrier configured to support the optical subassembly, an optical fiber fixed to the optical subassembly, a focusing optical system consisting two foci with one focus coincident with the input of optical fiber, an optical isolator to transmit light unidirectionally between two foci, an input boundary provided by the carrier to align the optical subassembly with the planar optical waveguide output. In particular, the optical subassembly is operably configured to provide a low transmission loss for light traveling from the planar optical waveguide output to the optical fiber.

Optical subassembly for non-reciprocal coupling of light and assembly process thereof

A transmitter optical sub-assembly (TOSA) structure having an independent upward heat dissipation path for dissipating heat in an upward direction including an independent signal source, an LDU assembly including a laser diode emitting a plurality of optical signals, a cascade LDU holding the laser diode, a lens positioned in front of the laser diode on the cascade LDU and an optical bench assembly including an optical bench assembled on a photonic integrated circuit having a plurality of passive optical components assembled on the optical bench. In particular, the independent signal source, the laser diode and the cascade LDU, are independent from the plurality of passive optical components on the photonic integrated circuit.

Transmitter optical sub-assembly (TOSA) structure and an active alignment method thereof

An optical mode converter for coupling between photonic integrated circuit (PIC) and optical fiber of different mode sizes is illustrated. The optical mode converter includes a waveguide assembly including a Single waveguide structure, a Multi-layer waveguide structure, and a Transitional waveguide structure. The Single waveguide structure includes a single waveguide. The dimension and propagation constant of a first end, of the single waveguide, is similar to a waveguide of a photonic integrated circuit (PIC). Furthermore, the Multi-layer waveguide structure included a multi-layer waveguide. Further, the Transitional waveguide structure is formed at a transitional structure. The Transitional waveguide structure allows transition of an optical mode between the Single waveguide structure and Multi-layer waveguide structure. The Multi-layer waveguide structure is configured for coupling light between the Transitional waveguide structure and an optical fiber and the Single waveguide structure is configured for coupling the light between the PIC and the Transitional waveguide structure.

Optical mode converter for coupling between waveguides with different mode size

A method and a system for active alignment of a light source assembly along three dimensions in an optical bench plane are provided. The light source assembly, preferably a laser diode on its sub-mount, is actively aligned in three dimensions, longitudinal, transection and vertical along the optical bench. The light source assembly is attached on edge of the optical bench, via adhesion processes, such as solder welding. Optical components such as collimator lens, isolator, etc are first passively aligned on the optical bench using alignment marks and epoxy slots provided on the surface of the optical bench. Then, laser diode, mounted on a laser diode sub-mount, is aligned in X and Z direction. Thereafter, the light source assembly is pushed towards the edge of the optical bench and attached with the edge via a solder joint. Also, a compensator can be actively aligned until the optimum light intensity achieved.

Laser diode edge assembly structure for three-dimensional active alignment in transmitter optical assembly

The present disclosure relates to an enclosed electronic module with single/multiple active components and an integrated heat dissipation system, including a top housing formed with one or more openings, a heat sink mounted on an outer surface of the top housing over the opening(s) thereof, a bottom housing coupled with the top housing, one or more active components mounted on a PCB between the top and bottom housings, and at least one thermal block or vapor chamber thermally connected between the heat sink and the active component(s), thereby forming one or more thermal dissipation paths extending from the active component(s), through the at least one thermal block or vapor chamber, and to the heat sink.

Heat dissipation system of enclosed electronic module with single/multiple active components

A silicon photonics package includes an L-shaped block formed from a cuboid having a through-hole through front and rear faces thereof. The L-shaped block includes two horizontal inner surfaces lying in a plane longitudinally bisecting a section of the through-hole, a bisected through-hole formed between the two horizontal inner surfaces, and a vertical inner surface. A lens block with a lens or lens array is bonded on the rear face of the L-shaped block. A vertical metal pad is attached on the front face of the L-shaped block. The vertical metal pad is soldered together with two horizontal metal pads on a photonic integrated circuit block formed with a waveguide or waveguide array such that the center of the optical lens is optically aligned with the waveguide. A method for fabricating the silicon photonics package, and an active alignment method for light coupling are also disclosed.

Method for fabricating silicon photonics package, active alignment method for light coupling, and silicon photonics package

A micro optical engine assembly including a printed circuit board, a frame mounted on the printed circuit board, a micro optical engine mounted on the printed circuit board within a central space of the frame, a jumper having a lens-carrying end placed on top of the micro optical engine and aligned therewith by alignment members to thereby limit horizontal movement of the jumper, and a latch having a snap mechanism releasably snapped onto the frame, and at least one spring plate resiliently pressing against an upper surface of the jumper when the latch is snapped onto the frame to thereby limit vertical movement of the jumper.

Micro optical engine assembly

An optical finger navigation module includes a light source mounted below a window plate formed on a housing of the module, a driver for outputting a current to the light source, an environmental sensor for sensing an environmental condition and providing a signal, and a sensor integrated circuit including a processor coupled with the environmental sensor for reading the signal and generating a compensated current that corresponds to the signal based on a compensation curve tailor-made for the light source and derived from a compensation algorithm using compensation factors. A method for increasing lifetime of the module is also disclosed.

Optical finger navigation module for extreme temperature operation and method for increasing life time of OFN module

An optical connector includes a lens block mounted in a MPO housing and optically coupled between an optical light guide and an external coupling light guide. A first lens formed on a first surface of the lens block to totally reflect and collimate light emitting from the optical light guide to a second surface. The second surface is coated with a partial transmission coating on a transmitter side and a total reflective coating on a receiver side. A second lens formed on a third or fourth surface on the lens block for focusing light from the second surface onto the external coupling light guide.

Optical connector for data transceiver modules and lens block for optical connectors

A wafer-level packaged optical subassembly includes: a substrate element, the substrate element including a top layer and a base layer being bonded with the top layer; a top window cover being bonded with the top layer of the substrate element; and a plurality of active optoelectronic elements disposed within the substrate element. At least one primary cavity is defined in the substrate element by the top layer and the base layer, and configured for accommodating the active optoelectronic elements. A plurality of peripheral cavities are defined around the at least one primary cavity as alignment features for external opto-mechanical parts.

Wafer-level packaged optical subassembly and transceiver module having same

A CWDM transceiver module includes: a substrate; a plurality of light sources disposed on the substrate; a spacer layer disposed above the substrate, a cavity being defined in the space layer to accommodate the light sources; a cap layer transparent to light emitted from the light sources and disposed on the spacer layer, a notch for assembling a waveguide being formed in the cap layer; a plurality of lenses disposed on the cap layer facing the light sources; reflector coating and filter coating disposed on surfaces of the cap layer; an active alignment element disposed on the cap layer; and a reflector disposed at bottom of the notch.

CWDM transceiver module

An optical engine for data communication includes a substrate, an array of optical semiconductor devices mounted on the substrate, a device lens block mounted on the substrate and formed with a cavity for accommodating the array of optical semiconductor devices, a jumper lens block coupled with the device lens block at an upper surface thereof, and a fiber array mounted on the jumper lens block and optically coupled with the array of optical semiconductor devices. The jumper lens block is aligned with the device lens block by alignment posts and notches. A metal latch is used to hold the jumper lens block on the device lens block.

Optical engine for data communication

A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.

Growing community of inventors

Hong Kong, China

Vincent Wai Hung