Lumentum Operations LLC

Jds Uniphase Corporation

Vincent V Wong

Jay A Skidmore

An-Chun Tien

Kong Weng Lee

James Yonghong Guo

Prasad Yalamanchili

Yonghong Guo

Lucas Morales

Bryed Billerbeck

John Michael Miller

Pezhman Monadgemi

Lei Yang

Matthew Glenn Peters

Jihua Du

Raman Srinivasan

Erik Paul Zucker

Reddy Raju

Ferdinand Mendoza

Gity Samadi

Yongfeng Guan

Slava Khassine

A dot projector may include a vertical-cavity surface-emitting laser (VCSEL). The dot projector may include one or more collimating elements to collimate light emitted by the VCSEL. An effective focal length of the one or more collimating elements may be larger than an optics length of the dot projector. The dot projector may include an optical element including a periodic optical phase function to replicate the light after collimation by the one or more collimating elements and an aberration-correcting phase function to correct spot aberrations in a dot pattern resulting from the tiling or splitting of the light.

Dot projector including hybrid refractive-diffractive optical elements

An emitter array, may comprise a first set of emitters that has a nominal optical output power at an operating voltage. The emitter array may comprise a second set of emitters that has substantially less than the nominal optical output power or no optical output power at the operating voltage. The first set of emitters and the second set of emitters may be interleaved with each other to form a two-dimensional regular pattern of emitters that emits a random pattern of light at the nominal optical output power at the operating voltage. The first set of emitters and the second set of emitters may be electrically connected in parallel.

Modified emitter array

A structured light system may include a semiconductor laser to emit light and a diffractive optical element to diffract the light such that one or more diffracted orders of the light, associated with forming a structured light pattern, are transmitted by the diffractive optical element. The diffractive optical element may be arranged such that the light is to be incident on the diffractive optical element at a substantially non-normal angle of incidence. The substantially non-normal angle of incidence may be designed to cause the diffractive optical element to transmit a zero-order beam of the light outside of a field of view associated with the diffractive optical element.

Diffractive optical element with off-axis incidence for structured light application

Food cooling rack

Diffractive optical element with off-axis incidence in a structured light application

A device may include a lead-frame including a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.

Emitter-on-sub-mount device

A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

Chip-scale package and semiconductor device assembly

The use of one or more angled or curved and diverging light pipes or reflectors placed in a light source's, e.g. diode's, emission path at appropriate distances, angles and divergence, such that a diode's emission spot size is modified and or redirected from the diode's natural emission path to alternative planes at angle to the diode's natural emission path so that a diode emission safe spot size can be achieved on any plane at angle to the original diode natural emission path at minimum distances from the diode's point of emission.

Low profile depth camera

A time of flight camera device comprises an light source for illuminating an environment including an object with light of a first wavelength; an image sensor for measuring time the light has taken to travel from the light source to the object and back; optics for gathering reflected light from the object and imaging the environment onto the image sensor; driver electronics for controlling the light source with a high speed signal at a clock frequency; and a controller for calculating the distance between the object and the illumination unit. To minimize power consumption and resulting heat dissipation requirements, the light source/driver electronics are operated at their resonant frequency. Ideally, the driver electronics includes a reactance adjuster for changing a resonant frequency of the illumination unit and driver electronics system.

Power efficient pulsed laser driver for time of flight cameras

A leadframe-type packaged laser diode is provided, in which the laser diode chip is electrically decoupled from the package. A leadframe-type package including a two-dimensional grid of electrodes encapsulated in a molded plastic framework allows batch processing of one- or two-dimensional arrays of leadframes, the batch processing including laser diode chips attachment, wirebonding, and packaging, with subsequent breakout of individual packaged laser diodes from the one- or two-dimensional array.

Packaged laser diode and method of packaging a laser diode

A time-of-flight (TOF) sensor pixel is provided that performs in-pixel subtraction. The TOF sensor pixel includes a photodetector, a capacitor, and circuitry. The photodetector detects light pulses emitted at a clock frequency, after a time of flight, to provide a photocurrent. The capacitor integrates the photocurrent over an integration period, while the circuitry reverses a flow direction of the photocurrent through the capacitor at twice the clock frequency. At the end of the integration period, the capacitor provides a differential photocharge, corresponding to a capacitor voltage. The capacitor voltage is related to the time of flight of the light pulses and may be used to determine a distance to a target.

Time-of-flight (TOF) system, sensor pixel, and method

A high field of view, low height package and wafer-level packaging process are provided. The top surface of a first wafer has recesses defined by sidewalls, with a reflector, and a floor. The reflector is incident a horizontal light path form an edge-emitting diode on the floor, directing the light path vertically. A second optically diffusing wafer receives the vertically directed light. A vertical ring to surround each recess is wafer-level fabricated on one of the wafers. The vertical ring may have a high aspect ratio to increase light diffusion. The second wafer is connected above the first such that each vertical ring encloses its corresponding recess and such that the light vertically exits the optically diffusing media after spanning the height of the vertical ring. Diode electrical connections are provided for externally controlling the diode. Individual packages are separated by double-dicing the connected wafers between the recesses.

Structure and method for edge-emitting diode package having deflectors and diffusers

A reflector is mounted to an outer perimeter of a heat sink holding at least one edge-emitting semiconductor chip, for example a laser diode. The reflector has a shape suitable for gathering light emitted by the laser diodes and redirecting the light in an upward direction away from the heat sink. The reflector can be overmolded onto the heat sink. The reflector can operate by total internal reflection, so that no additional reflector coating step is required. Injection molding of the reflectors onto the heat sink holding the laser diodes enables mass production of powerful yet inexpensive laser light sources.

Semiconductor light source having a reflector

The present invention relates to the packaging of high power laser(s) in a surface mount technology (SMT) configuration at low-cost using wafer-scale processing. A reflective sidewall is used to redirect the output emission from edge-emitting lasers through an optical element (e.g., a diffuser, lens, etc.). A common electrical pad centered inside the package provides p-side connection to multiple laser diodes (i.e. for power scalability). Thick plating (e.g. 75 um to 125 um) with a heat and electrically conductive material, e.g. copper, on a raised bonding area of a substrate provides good heat dissipation and spreading to the substrate layer during operation. The composite CTE of the substrate layer, e.g. AlN, and the heat/electrical conductive plating, e.g. Cu, substantially matches well with the laser substrates, e.g. GaAs-based, without the requirement for an additional submount.

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Los Altos, CA, United States of America

Vincent V Wong