Microchips, Inc.

Vincent Utsi

Mark Norris

Jean-Daniel Richerd

An apparatus for providing transdermal wireless communication includes medical implant circuitry; a transceiver coupled to the medical implant circuitry; a first metal surface having an end portion and a base portion; a second metal surface parallel to the first metal surface and connected to the first metal surface by a conductor, the second metal surface being separated from the first metal surface by a dielectric layer; a first radiating element tuned to a first frequency and disposed within the dielectric layer between the first metal surface and second metal surface; and a feed structure in electrical communication with the transceiver and the first radiating strip. The first radiating element has a first reactive portion at a first end thereof, a second reactive portion at a second end thereof, and a first radiating strip extending between the first reactive portion and the second reactive portion.

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Ely, United Kingdom

Vincent Utsi