Applied Materials, Inc.

Vincent Steffan Francischetti

Kyle Moran Hanson

Brian J Brown

Robert B Moore

Ekaterina A Mikhaylichenko

Gregory J Wilson

Paul R McHugh

Paul Zachary Wirth

Randy Harris

Jonathan Stuart Frankel

Satish Sundar

David Brian Curliss

Mario David Silvetti

Nicholas Elmo Jack

Jason A Rye

Bryan Puch

An improved hybrid composite projectile barrel comprising an inner liner and an outer composite matrix, the inner liner having a breech transition region and a muzzle transition region. The breech transition region and the muzzle transition region each comprises locking features that secure the outer composite matrix to the inner liner at the transition regions. In a first embodiment, the locking features are a series of longitudinally extending ribs with notches. In a second embodiment, the locking features are a plurality of pins disposed around the circumference of the breech and muzzle transition regions. In a third embodiment, the ridges and pins are combined such that a pin extends from the top of each ridge. In each embodiment with pins, the height of the pins is preferably adjusted so that the top ends of the pins form a line that is parallel with the outer diameter of the inner liner.

Hybrid composite projectile barrel

In some embodiments, a system is provided that includes (1) a loading position; (2) a drying position; (3) a movable tank configured to (a) hold at least one substrate; (b) hold a cleaning chemistry so as to expose a substrate within the movable tank to the cleaning chemistry; and (c) translate between the loading position and the drying position; and (4) a drying station located at the drying position and configured to rinse and dry a substrate as the substrate is unloaded from the movable tank when the movable tank is at the drying position. Numerous other aspects are provided.

Systems and methods for rinsing and drying substrates

An example waterfall apparatus includes (1) a first portion of a first width having (a) a first plenum, a second plenum, and a restricted fluid path therebetween; (b) a first coupling surface; and (c) an inlet opening that creates a fluid path between the first coupling surface and the first plenum; and (2) a second portion of a second width larger than the first width and having (a) a second coupling surface; and (b) an inlet aligned with the first portion inlet opening. The first and second coupling surfaces form a slot that extends along at least a portion of a length of the waterfall apparatus and that connects to the second plenum. Fluid introduced into the second portion inlet fills the first plenum, travels through the restricted fluid path to the second plenum, and exits the slot between the first and second portions to form a rinsing fluid waterfall.

Substrate rinsing systems and methods

A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.

Wafer processing system with chuck assembly maintenance module

A processing apparatus may include a down-facing substrate processing chamber fixed at acute angle to horizontal. A chuck plate on a platform may pivot from an open position wherein the platform is at an acute angle to the processing chamber, to a parallel position wherein the platform is parallel to the processing chamber. The chuck plate may then be moved linearly into sealing engagement with the processing chamber. A chuck holder may be provided on the platform to hold the chuck in place.

Vacuum pre-wetting apparatus and methods

An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500&#xb0; C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

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Columbia Falls, MT, United States of America

Vincent Steffan Francischetti