Silios Technologies

Vincent Sauget

Laurent Roux

Marc Hubert

Stephane Tisserand

Aurélien Faiola

Stéphane Tisserand

A hybrid multispectral imaging sensor, characterized in that it comprises a photosensitive backside-illumination detector (DET) that is made on a substrate () made of InP, and that is formed of a matrix of pixels (, P, P, P) that are themselves made in a structure based on InGaAs (), and a filter module (MF) that is formed of a matrix of elementary filters (λ) reproducing said matrix of pixels, and that is mounted into contact with said substrate (), said substrate () made of InP having a thickness less than 50 μm, and preferably less than 30 μm.

Multispectral imaging sensor provided with means for limiting crosstalk

A method of limiting cross-talk in an imaging sensor, the sensor being in the form of a matrix of macropixels defining an image, each macropixel being formed by a matrix of individual pixels, each of which is dedicated to a distinct spectral band, all of the individual pixels dedicated to the same spectral band forming a sub-image, the image being topologically subdivided into at least one parcel, and the method including the following steps: measuring the spectral response of each individual pixel &#x3bb;; calculating the mean spectral response of each sub-image in a parcel; targeting to define the ideal response of each sub-image in the parcel; estimating a series of coefficients for minimizing cross-talk in the parcel; and applying the coefficients to the macropixels in order to correct the sub-images in the parcel. The method is remarkable in that the ideal response is a Gaussian function.

Method for limiting crosstalk in an image sensor

The invention relates to a multispectral imaging device including: a photosensitive detector DET made up of a matrix of pixels; an array of microlenses ML, ML, MLreproducing the matrix of pixels; and a filter module MF formed by a matrix of individual filters &#x3bb;reproducing the matrix of pixels. The device is remarkable in that the array of microlenses is arranged directly in contact with the detector DET, and the filter module MF is made on a substrate SS that is put into contact with the array of microlenses.

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Aix-en-Provence, France

Vincent Sauget