Genrife Company Limited

Vincent S Chen

Haw-Chan Tan

Frank C Ma

An I/O card assembly (1) is provided having an insulative frame means (10, 40) sandwiched by a pair of generally similar conductive covers (50, 70). Each cover (50) includes a main plate (52) and two elongated side shielding walls (56) downward extending from two opposite sides of the plate (52) a first distance which is generally half of a height of the side wall (12) of the frame (10). A groove (18) horizontally extends along the center line of side wall (12) of the frame (10) for receiving both the hook sections (58) which are respectively inwardly formed at the outermost edges of the side shielding walls (56) of the top and the bottom covers (50, 70). Between the top and the bottom covers (50, 70), an internal PC board (80) is seated on the frame whereby two connectors (90, 100) are respectively soldered on two opposite end regions of the PC board (80) and respectively retained at two opposite ends of the main frame (10) and therefore, the PC board (80) and the two associated connectors (90, 100) are appropriately held in position in the card assembly (1) for mating with the corresponding electrical devices.

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Walnut, CA, United States of America

Vincent S Chen